نتایج جستجو برای: humidity sensor ag cu

تعداد نتایج: 311258  

Journal: :international journal of nanoscience and nanotechnology 2012
s. m. m. shafiei e. salahi s. a. tayebi fard

solid solutions of ag-cu were prepared via ball milling process, for about 5-30 h. the cu-20at%ag and cu-3.64at%ag composition were investigated by x-ray diffraction technique. it was realized that the solid solubility level could be increased by increasing the initial solute content in the mixture. in addition, shifts in peak positions of silver and copper were observed with milling time. the ...

Journal: :Physical chemistry chemical physics : PCCP 2010
Shigeru Ikeda Takayuki Nakamura Takashi Harada Michio Matsumura

A series of mixed crystals composed of Cu(2)ZnSnS(4), Ag(2)ZnSnS(4) and ZnS was prepared by co-precipitation of the corresponding metal ions in aqueous sodium sulfide followed by annealing in a sulfur atmosphere. Ideal solid solutions of Cu(2)ZnSnS(4) and Ag(2)ZnSnS(4) with a kesterite structure ((Cu(x)Ag(1-x))(2)ZnSnS(4) (0 ≤x≤ 1)) were successfully obtained by this procedure, as confirmed by ...

2014
Chang-Hung Lee Wen-Yu Chuang Melissa A. Cowan Wen-Jung Wu Chih-Ting Lin

A low-power, wide-dynamic-range integrated humidity sensing chip is implemented using a printable polymer sensing material with an on-chip pulse-width-modulation interface circuit. By using the inkjet printing technique, poly(3,4-ethylene-dioxythiophene)/polystyrene sulfonate that has humidity sensing features can be printed onto the top metal layer of a 0.35 μm CMOS IC. The developed printing-...

2002
C. L. Platt K. W. Wierman E. B. Svedberg R. van de Veerdonk J. K. Howard D. E. Laughlin

The influence of Cu, Ag, and Au additives on the L10 ordering, texture, and grain size of FePt thin films has been examined. Lattice parameter data indicated that Au and Ag additives tended to segregate from FePt, but Cu alloyed with FePt. FePt films with Au or Ag additive showed 1–2 kOe higher coercivity values compared to a pure FePt film after annealing at 450 °C and above for 10 min. The ad...

Journal: :Biochemistry 2006
Joshua T Kittleson Isabell R Loftin Andrew C Hausrath Kevin P Engelhardt Christopher Rensing Megan M McEvoy

The periplasmic protein CusF, as a part of the CusCFBA efflux complex, plays a role in resistance to elevated levels of copper and silver in Escherichia coli. Although homologues have been identified in other Gram-negative bacteria, the substrate of CusF and its precise role in metal resistance have not been described. Here, isothermal titration calorimetry (ITC) was used to demonstrate that Cu...

Journal: Nanochemistry Research 2020

In this study, Cu, Ag, and Fe nanoparticles (NPs) are used in shampoo, hand washing liquid (HWL) and dish washing liquid (DWL) instead of the conventional synthetic preservatives such as isothiazolinones; since the latter often act as potent sensitizers that leads to development of allergic contact dermatitis. The above NPs are considerably effective against Escherichia coli and Staphylococcus ...

Journal: :Carbohydrate polymers 2014
N Mat Zain A G F Stapley G Shama

Silver and copper nanoparticles were produced by chemical reduction of their respective nitrates by ascorbic acid in the presence of chitosan using microwave heating. Particle size was shown to increase by increasing the concentration of nitrate and reducing the chitosan concentration. Surface zeta potentials were positive for all nanoparticles produced and these varied from 27.8 to 33.8 mV. An...

Journal: :Materials Science and Engineering A-structural Materials Properties Microstructure and Processing 2021

The microstructure, precipitation kinetics, electrical conductivity, and mechanical properties of Cu-7.9 wt%Ag Cu-5.8 doped with 0.6 wt%Nb were investigated. As-cast microstructure revealed both discontinuous continuous Ag in Cu matrix. Differential scanning calorimetry data indicated that occurred at higher temperatures activation energy. Both micro-sized nano-sized Nb particles observed the N...

2016
Jiaxiang Li Yunping Li Zhongchang Wang Huakang Bian Yuhang Hou Fenglin Wang Guofu Xu Bin Liu Yong Liu

The electrical conductivity of pure Cu powder is typically deteriorated at elevated temperatures due to the oxidation by forming non-conducting oxides on surface, while enhancing oxidation resistance via alloying is often accompanied by a drastic decline of electrical conductivity. Obtaining Cu powder with both a high electrical conductivity and a high oxidation resistance represents one of the...

2013
Hengchang Bi Kuibo Yin Xiao Xie Jing Ji Shu Wan Litao Sun Mauricio Terrones Mildred S. Dresselhaus

Humidity sensors have been extensively used in various fields, and numerous problems are encountered when using humidity sensors, including low sensitivity, long response and recovery times, and narrow humidity detection ranges. Using graphene oxide (G-O) films as humidity sensing materials, we fabricate here a microscale capacitive humidity sensor. Compared with conventional capacitive humidit...

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