This paper presents a numerical analysis of natural convection dominated melting inside a rectangular enclosure from three discrete heat sources. This analysis is motivated by the need to improve the design of a latent heat thermal energy storage system. It also finds applications in the cooling of electronic equipment. A computational methodology based on the enthalpy method for phase change i...

The paper demonstrates the model order reduction procedures applied to semiconductor devices with multiple heat sources. The approach is demonstrated for a device with nine heat sources where some of them are permanently active and other work under switching conditions. For the order reduction the software package MOR for ANSYS is used, which is based on the Krylov subspace method via the Arnol...

Accurate and optimum usage of energy sources is gaining importance all over the world due to the increase of energy need and limited energy sources. Optimum usage of energy sources is not only necessity for energy conversion systems, but also design and production of energy conversion devices. Therefore optimization of condensers is very important for HVAC systems which require as possible as m...

The WBGT heat stress index has been well tested under a variety of climatic conditions and quantitative links have been established between WBGT and the work-rest cycles needed to prevent heat stress effects at the workplace. While there are more specific methods based on individual physiological measurements to determine heat strain in an individual worker, the WBGT index is used in internatio...

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Public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching existing data sources gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate only, other aspect of this collection of information, including su...

In this work we have proposed a geometric model that is employed to devise a scheme for identifying the hotspots and zones in a chip. These spots or zone need to be guarded thermally to ensure performance and reliability of the chip. The model namely continuous unit sphere model has been presented taking into account that the 3D region of the chip is uniform, thereby reflecting on the possible ...