The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality silicon wafers involves several machining processes including grinding. This review paper discusses historical perspectives on grinding of silicon wafers, impacts of wafer size progression on applications of grinding in silicon wafer manufacturing, and interrelationships between grinding and two oth...

This paper describes a novel and simple method for measuring the physical strength of pharmaceutical pellets prepared by extrusion granulation. Pharmaceutical powders composed of lactose, cornstarch, and microcrystalline cellulose were kneaded with purified water and dry binder (hydroxypropylcellulose), then extruded through a dome-type extrusion granulator. The physical strength of the dried e...

Surface roughness is a variable often used to describe the quality of ground surfaces as well as to evaluate the competitiveness of the overall grinding system. The subject of this paper is a grinding process performed on P20 tool steel by changing the grinding conditions, including the depth of cut, the grinding passes, the type of wheel, and the cutting fluid supply in the experiment. The mai...

The quality and economy of grinding depend on proper selection of grinding conditions for the materials to be ground. In order to evaluate the effect of heavy-duty grinding, a new performance index, which includes specific material removal rate, size accuracy, and grinding forces, was proposed. Robust design of experiment, including orthogonal arrays, the signal-to-noise ratio (SNR) method, and...

A simple and effective solution to the robot grinding problem is introduced, which significantly reduces vibrations during grinding without additional actuators or active control. The objective is to determine the optimal compliance design for grinding robot tool holders. Specifically, the tool holder design should improve accuracy and productivity while protecting the robot arm from the large ...

In this investigation, experiments were carried out to understand the influence of various grinding parameters like wheel speed, workspeed and depth of cut on the grinding temperature at the surface of the Al-SiCP composite workpiece with different grinding wheels. The temperature distribution within the workpiece was studied by simulating the grinding process and using finite element analysis ...

This paper reports ductile or partial ductile mode machining of silicon, glass and some advanced ceramics. Results are presented using scanning electron micrographs of the machined surfaces. Grinding and lapping operations using inexpensive machine tools could produce ductile streaks on surfaces of these brittle materials under good conditions. Manufacture of spherical glass lenses by the fract...

We prepared and characterized a grinding-induced equimolar complex of thiourea with ethenzamide. When thiourea and ethenzamide were co-ground at a molar ratio of 3 : 1, new powder X-ray diffraction (PXRD) peaks were observed in addition to PXRD peaks of thiourea crystals. The optimum stoichiometry of the new structure was confirmed as 1 : 1 mol/mol. Effect of grinding time on the thiourea-ethen...

Grinding is a complex material removal process with a large number of parameters influencing each other. In the process, the grinding wheel surface contacts the workpiece at high speed and under high pressure. The complexity of the process lies in the multiple microscopic interaction modes in the wheel-workpiece contact zone, including cutting, plowing, sliding, chip/workpiece friction, chip/bo...

The application of emulsion for combined heat extraction and lubrication requires continuous monitoring of the quality of emulsion to sustain a desired grinding environment; this is applicable to other grinding fluids as well. Thus to sustain a controlled grinding environment, it is necessary to adopt an effectively lubricated wheel-work interface. The current study was undertaken to assess exp...