Methods of effective and ecological recycling of printed circuit boards (PCBs) are searched all over the world at this time. The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For this purpose we analyzed weight ratio of the electronic components moulded on the selected kinds of PCBs and next we formulated mathematic model o...

The Artificial Intelligence (AI) based modeling techniques applied to the industrial grinding operation of a lead-zinc ore-beneficiation plant to predict the key performance indicators (KPIs) for the circuit. As system identification of the non-linear process is a must in advanced control, AI based techniques are applied to predict the KPIs within some acceptable limits. The nonparametric model...

A first principles model of a cement grinding circuit is developed for the purpose of multi-variable model predictive control (MPC). The model is based on a series of mixed flow reactors with an ideal screen to model flow between the two chambers in the ball mill. The separator is modelled by efficiency curves. Breakage of the particles is modelled as a first order process in terms of functions...

This paper presents results obtained from the grinding of aluminium-based metal matrix composites reinforced with either aluminium oxide (Al2O3) or silicon carbide (SiC) particles using grinding wheels made of SiC in a vitrified matrix or diamond in a resin-bonded matrix. The study used grinding speeds of 1100–2200 m min , a grinding depth of 15 m for rough grinding and 0.1–1 m for fine grindin...

Study on ambient and cryogenic grinding was performed to test the novelty of cryogenic grinding and pin point the drawbacks of ambient grinding. Comparative study had shown that ambient grinding need more power (8.92%) and specific energy (14.5%) than cryogenic grinding. Particle size analysis had shown that cryogenic grinding produced coarser particles. Comparative study of energy law constant...

Abstract: In this paper a reduced structure multivariable controller is developed for the model of a closed-system grinding circuit. The said controller is developed using a novel technique which employs basis pursuit regularization in order to generate a family of solutions which together span the entire range from decentralized to centralized controllers. Using this information, and the perfo...

This study investigates the grinding of sintered silicon nitride using a SiC wheel with a fine abrasive grit size and dense vitreous bond. The difference of hardness between the green SiC abrasive and sintered Si3N4 workpiece (25.5 vs. 13.7 GPa) is small. Large grinding forces, particularly the specific tangential grinding forces, are observed in SiC grinding of Si3N4. The measured specific gri...

Introduction When the grinding wheel specifications are properly chosen, a SiC grinding wheel performs remarkably well for grinding partially stabilized MgO-ZrO2 ceramics (MgO-PSZ). Rather surprisingly, the highest Gratios are obtained at higher grinding rates for the SiC wheel. This, and the fact that SiC grinding wheels can be readily shaped for use in precision cylindrical form grinding, has...

Surface roughness is a significant parameter which determines the efficiency of optical components. Surface damages induced by grinding strongly influence the mechanical strength and optical quality of optical glasses. It is meaningful to rapid evaluate the surface roughness through the measurement of different grinding parameters. In this study, a cup diamond wheel (D64) is used in grinding pr...