Compression creep tests were performed on the ternary 91.84Sn-3.33Ag-4.83Bi (wt.%, abbreviated Sn-Ag-Bi) Pb-free alloy. The test temperatures were: −25 °C, 25 °C, 75 °C, 125 °C, and 160 °C (± 0.5 °C). Four loads were used at the two lowest temperatures and five at the higher temperatures. The specimens were tested in the as-fabricated condition or after having been subjected to one of two air a...

in this article, the effects of adding zn and conducting age hardening treatment on impression creep properties of mg-5%sn alloy have been investigated. the creep tests were carried out using impression creep method in which a cylindrical punch was used to apply the stress in range of 450 mpa < σimp < 270 mpa and at the test temperatures of 150, 175 and 200 °c. the results showed that age harde...

Native collagen gels are important biomimetic cell support scaffolds, and a plastic compression process can now be used to rapidly remove fluid to any required collagen density, producing strong 3D tissue-like models. This study aimed to measure the mechanical creep properties of such scaffolds and to quantify any enhanced creep occurring in the presence of cells (cell-mediated creep). The test...

The effect of molybdenum (Mo) on the microstructure and creep behavior of nominally Ti–24Al– 17Nb (at.%) alloys and their continuously reinforced SiCfiber composites (fiber volume fraction = 0.35) was investigated. Constant-load, tensile-creep experiments were performed in the stress range of 10–275 MPa at 650 C in air. A Ti–24Al–17Nb–2.3Mo (at.%) alloy exhibited significantly greater creep res...

Indentation creep tests and finite element simulations were performed on a model material to show that the constitutive equation for conventional uniaxial creep can be derived using the instrumented indentation testing technique. When the indentation pressure and the indentation creep rate are maintained at constant values of ps and _ 3⁄4inðsÞ, respectively, the contours of the equivalent stres...

Indentation creep tests were performed on an Al-5.3mol% Mg solid-solution alloy to examine whether mechanical properties can be extracted accurately from a testpiece, as small as a rice grain. A conical diamond indenter was pressed into a test surface with a constant load F at temperatures ranging from 0.60 to 0.65 Tm (Tm: the absolute liquidus temperature). When the representative flow stress ...

It is crucial to understand the creep behavior of Pb-free solder alloys in electronic packaging. Typical service environments are between 298 and 373K. The thermal mismatch induced stresses acting on solder joints result in extensive rate-dependent plastic deformation. The solder alloy is potentially the weakest component in the electronic package because normal operating temperatures are alrea...