the aim of this paper is to enhance thermal performance of a microchannel heat sink by using nanoencapsulated phase change material (nepcm) slurry as a cooling fluid instead of pure fluid. a threedimensional model of a circular channel using water slurry of nepcm was developed. the results show a significant reduction in the mean fluid temperature along the channel and heat sink wall temperatu...

We report a miniaturized fiber inline Fabry-Perot interferometer (FPI), with an open micro-notch cavity fabricated by one-step fs laser micromachining, for highly sensitive refractive index measurement. The device was tested for measurement of the refractive indices of various liquids including isopropanol, acetone and methanol at room temperature, as well as the temperature-dependent refractiv...

BACKGROUND Interventional medical devices based on thermally responsive shape memory polymer (SMP) are under development to treat stroke victims. The goals of these catheter-delivered devices include re-establishing blood flow in occluded arteries and preventing aneurysm rupture. Because these devices alter the hemodynamics and dissipate thermal energy during the therapeutic procedure, a first ...

This paper reports on the measured dc characteristics of a SiC JFET device from room temperature up to 450◦C in order to evaluate the device’s capability for high-temperature operation. The authors packaged SiC JFET bare die into a dedicated high-temperature package to be able to perform experiments under extremely high ambient temperatures. The experimental results show that the device can ope...

We develop a temperature controllable microfluidic device for the accurate measurement of temperature dependent interfacial tensions between two immiscible liquids. A localized temperature control system is integrated with the microfluidic platform to maintain an accurate temperature inside the device. The temperature uniformity and sensitivity are verified by both simulation and experimental r...

This paper explores the temperature dependent h terojunction beh vi r of n-type zinc oxide (ZnO) nanowires/pSi diodes. The device behavior at different temperatures in forward as well as reverse biased conditions are studied and reported. From the detailed electrical properties, it is confirmed that the fabricated p–n diode showed a good stability over the temperature range of 25–130 C. The tur...

This paper presents the variation law of temperature in three-dimensional space, which is cooled by the refrigeration provided by the cold side of a semiconductor. The mathematical model of the temperature field of the semiconductor refrigeration device is described, and a numerical study on the temperature profile in a semiconductor refrigeration device was carried out using this model. The pr...

important aspect of computer design, with device performance being significantly affected by temperature. In addition, device lifetime can be decreased drastically because of large thermal stresses that occur especially at interfaces. The ability of a structure to remove heat is best quantified by its thermal resistance, which is given by the temperature difference divided by input power. In mi...

The aim of this paper is to enhance thermal performance of a microchannel heat sink by using nanoencapsulated phase change material (NEPCM) slurry as a cooling fluid instead of pure fluid. A threedimensional model of a circular channel using water slurry of NEPCM was developed. The results show a significant reduction in the mean fluid temperature along the channel and heat sink wall temperatu...

One of the key advantage of SiC power devices over their Si counterparts is their ability to operate at higher temperature (in theory up to 1000 K for a 1000 V-rated SiC device as compared to less that 500 K for a comparable Si device [1]). Practical tests have already demonstrated operation at elevated temperature. For example, in [2], SiC JFET and diode operate at 450°C (723 K) ambient temper...