This research was conducted to determine the effect of addition Titanium (Ti) and sintering temperature variation on MMC CuC alloys as reinforcing elements. The process this uses powder metallurgical method with an alloying technique in Mechanical Alloying using a Planetary Ball Mill (PBM) machine speed 600 rpm for 2 hours, ratio ball mill is 10:1. compacting carried out dies 11 mm diameter pre...

Atomic configurations in P phase Cu-Al-Ni, Cu-Au-Zn and Cu-Zn-A1 ternary alloys before and after martensitic transformations, and occupancy sites of third elements X in the B2 parent lattice of Ti-Ni-X ternary alloys, where X = 3d elements, Pd and Au, have been investigated by means of an electron chanueling enhanced microanalysis method, called ALCHEMI. Large increases in M, and A, temperature...

Aluminium, Au, Be, Co, Cr, Cu, Hg, Ir, Ni, Pd, Pt, Rh and Ti represent causes of metal-induced allergic contact dermatitis (ACD) which expresses in a broad spectrum of cutaneous adverse manifestations. The exposure is primarily by skin contact with various items and products such as jewellery and piercing, cosmetics and tattoos, detergents, body implants and dental prostheses. To reduce the gro...

Titanium K-edge X-ray absorption near-edge structure (XANES) spectroscopy is used to examine the local Ti environments in the sol, gel, and xerogels of titanium oxide prepared by a sol-gel method. The xerogels were prepared by heat treatment at 200, 300, 400, 500, and 600 degrees C (denoted xero-200, xero-300, xero-400, xero-500, and xero-600), and the xerogels were doped with Fe(II), Ni(II), a...

Abstract Cu–Cr–Ti alloy with gradient properties was prepared at 960°C for 2 h in air, 80% cold rolling, and then aging 500°C 1 h. The results showed that the surface layer of had achieved a good match electrical conductivity (96.2% International Annealed Copper Standard (IACS)), thermal stability (softening temperature 650°C), wear resistance (friction coefficient 0.17). Meanwhile, core region...

The electrical, thermal, and microstructural characteristics of Ti/Al/Ti/Au ~30 nm/100 nm/30 nm/30 nm! multilayer Ohmic contacts to n-GaN ~doping level 5310 cm) were studied. The lowest contact resistivity derived from the annealed contact was rS53.0310 V cm. The contacts were robust and showed high-thermal stability. X-ray diffraction and Auger electron spectroscopy studies were made to invest...

Abstract Ion-induced secondary electron emission of surfaces occurs in all gas discharges which have contact to such as electrodes or chamber walls. These electrons (SEs) play an important role, for instance, the performance DC discharges, RF and magnetron sputtering discharges. SE generation can be separated into potential (PEE) due neutralization incident ion upon impact kinetic (KEE) electro...

The well-established killing of bacteria by copper surfaces, also called contact killing, is currently believed to be a combined effect of bacterial contact with the copper surface and the dissolution of copper, resulting in lethal bacterial damage. Iron can similarly be released in ionic form from iron surfaces and would thus be expected to also exhibit contact killing, although essentially no...

This work reports the effect of TiC volume fractions on hardness TiC/TiCu/C composites synthesized through in situ reactive infiltration Ti-Cu alloy into porous carbon preforms prepared by 3 D-printing. Reactive melt at 1100 °C under argon C-preforms with different porosities resulted materials composed TiC, Cu-rich intermetallic matrix (Ti Cu 4 ) and residual carbon. The microstructure consist...