نتایج جستجو برای: cu safe 300

تعداد نتایج: 270786  

2015
Hoon Sun Jung Young-Joo Jang Sung-Hoon Choa Jae Pil Jung

The application of Cu-filled through-silicon via (TSV) in 3-D integrated circuit packaging faces several fabrication and reliability issues. In this study, we introduced a Cu-Ni alloy for TSV filling with a high filling speed and a reduced TSV protrusion. In particular, the characteristics of Cu-Ni via protrusions at various annealing temperatures (3200­450°C) were investigated with experimenta...

2007
Daojian Cheng Xin Liu Dapeng Cao Wenchuan Wang Shiping Huang

Segregation phenomena of Ag–Cu–Au trimetallic clusters with icosahedral structure are investigated by using a Monte Carlo method based on the second-moment approximation of the tight-binding (TB-SMA) potentials. We predict that the Ag atoms segregate to the surface of the Ag–Cu–Au trimetallic icosahedral clusters. The Ag concentrations in the surface layer of the clusters are about 11–29 at.% h...

2011
Yousef Fazaeli Amir Reza Jalilian Mohsen Kamali-dehghan Fatemeh Bolourinovin Sedigheh Moradkhani Gholamreza Aslani Ali Rahiminejad Mohammad Ghannadi-Maragheh

Introduction: [Cu]diacetyl-bis(N-methylthiosemicarbazone) ([Cu]ATSM) is a well-established hypoxia imaging tracer with reproducible production and significant specifity. In this work the high yield production and quality control as well as imaging studies in healthy rabbits is reported. Methods: Copper-64 produced via the Zn(p,n)Cu nuclear reaction (30 MeV protons at 180 μA) was used for the p...

2006
X.-T. Tang G.-C. Wang York M. Shima

The giant magnetoresistance GMR of multilayered Co/Cu nanowires potentiostatically electrodeposited inside the pores of an anodized alumina template was studied in the current perpendicular to the plane CPP geometry. The maximum magnetoresistance change of 13.5% was observed for Co 8 nm /Cu 10 nm nanowires at room temperature. The interfacial roughness and/ or an intermixing between Co and Cu l...

Journal: :Physical chemistry chemical physics : PCCP 2013
Sean P Berglund Heung Chan Lee Paul D Núñez Allen J Bard C Buddie Mullins

A new dispenser and scanner system is used to create and screen Bi-M-Cu oxide arrays for cathodic photoactivity, where M represents 1 of 22 different transition and post-transition metals. Over 3000 unique Bi : M : Cu atomic ratios are screened. Of the 22 metals tested, 10 show a M-Cu oxide with higher photoactivity than CuO and 10 show a Bi-M-Cu oxide with higher photoactivity than CuBi2O4. Cd...

Journal: :Gut 1988
S Lanzon-Miller R E Pounder N A Chronos F Raymond M R Hamilton D Dalgleish

Nine healthy volunteers were studied on the seventh day of dosing at 21:00 h with nizatidine 150 mg (N 150), nizatidine 300 mg (N 300), ranitidine 300 mg (R 300), or placebo, given in a predetermined random order. The double-blind 24 hour studies, using the Royal Free Hospital standard protocol, simultaneously measured intragastric acidity and plasma gastrin concentration. Compared with placebo...

Journal: :The Biochemical journal 2004
Lucía Tapia Mauricio González-Agüero Mónica F Cisternas Miriam Suazo Verónica Cambiazo Ricardo Uauy Mauricio González

MTs (metallothioneins) increase the resistance of cells to exposure to high Cu (copper) levels. Characterization of the MT-Cu complex suggests that MT has an important role in the cellular storage and/or delivery of Cu ions to cuproenzymes. In this work we investigate how these properties contribute to Cu homoeostasis by evaluating the uptake, accumulation and efflux of Cu in wild-type and MT I...

Journal: :Physical chemistry chemical physics : PCCP 2014
Katrine Lie Bøyesen Tina Kristiansen Karina Mathisen

Vanadium(V) and copper(II) were co-deposited into AlPO-5 and H-ZSM-5 three-dimensional microporous carriers to yield VCu:AlPO-5 and VCu:ZSM-5. The materials, along with copper analogues were tested for the selective oxidation of propene, and the catalysts perform in the following order: VCu:AlPO-5 > Cu:AlPO-5 > VCu:ZSM-5 > Cu:ZSM-5. Acrolein was selectively formed over VCu:AlPO-5 and Cu:AlPO-5 ...

2016
Pay Ying Chia A. S. M. A. Haseeb Samjid Hassan Mannan

Miniaturization of electronic devices has led to the development of 3D IC packages which require ultra-small-scale interconnections. Such small interconnects can be completely converted into Cu-Sn based intermetallic compounds (IMCs) after reflow. In an effort to improve IMC based interconnects, an attempt is made to add Ni to Cu-Sn-based IMCs. Multilayer interconnects consisting of stacks of C...

Journal: :Inorganic chemistry 2015
A M Willcocks T Pugh S D Cosham J Hamilton S L Sung T Heil P R Chalker P A Williams G Kociok-Köhn A L Johnson

We report here the synthesis and characterization of a family of copper(I) metal precursors based around cyclopentadienyl and isocyanide ligands. The molecular structures of several cyclopentadienylcopper(I) isocyanide complexes have been unambiguously determined by single-crystal X-ray diffraction analysis. Thermogravimetric analysis of the complexes highlighted the isopropyl isocyanide comple...

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