The creep and recovery of 5% carboxyl-terminated butadiene acrylonitrile (CTBN) modified epoxy shape memory polymers (SMP) was studied. The results were compared with those for the unmodified epoxy SMP. The glass transition temperatures (Tg) were determined using Advanced Rheometric Expansion System (ARES). The creep behavior of the unmodified epoxy and 5wt.% CTBN modified epoxy SMP were studie...

Creep compliance measurements were shown to be effective in characterizing the elastic, retarded elastic, and viscous properties of polysulphide, silicone, and polyether impression materials. The test is particularly valuable in that the creep compliance was independent of load, allowing the mechanical properties to be represented by a single total creep compliance curve which can be used to de...

A new experimental method which allows the direct separation of the components of drying creep due to micro cracking and stress-induced shrinkage is developed, demonstrated and validated. The hasic idea is to compare the curL'CIture creep of heams suhjected to the same hending moment hut rery different axial forces. The results confirm that drying creep has two different sources: microcracking ...

Original scientific paper Time-dependent deformations in soft rocks represent an important part of total deformations which occur after excavation of the tunnel opening. In the light of this, comprehensive laboratory uniaxial creep tests were performed on marl rock monolits. The testing used marl as a chosen representative rock samples of the group of soft rocks which exhibits creep behaviour. ...

Spark plasma sintering (SPS) method, as plasma activated sintering, is a method applicable for rapid sintering of metals and ceramics. Owing to the advantage of rapid heating, the alumina ceramics obtained by SPS have a grain size and density comparable to those of hot pressed ones. The increase of densification rate may be related to some difference in ion transport characteristics. This study...

Test printed circuit test boards (PCBs) with various surface finishes were subjected to a mixed flowing gas environment with gaseous composition adjusted to achieve a targeted 500600 nm/day copper corrosion rate. Board surface finishes included immersion silver (ImAg), organic solderability preservative (OSP) and lead-free hot-air-solder leveling (Pbfree HASL). The PCB test specimens were prepa...

materials exhibit significant creep behavior at temperatures above 40% of their absolute melt temperature. lead, tin and their alloys are such materials which experience significant creep behavior in room temperature. one of the most important applications of the tin-lead alloys is soldering electronic circuits in electronic industry, and for lead are isolation walls and wet batteries. room tem...