PURPOSE To demonstrate how Wavelight Contoura can be used to repair corneas damaged by trauma and prior poor surgical outcomes. METHODS Four representative eyes are presented that show different scenarios in which highly irregular corneas can be corrected with Wavelight Contoura using a protocol (named the San Diego Protocol) designed to use the information in Contoura processing. Both laser-...

Mention Tape Ball Grid Array (TBGA) and the first thing comes to mind is the high cost. In fact, most end users rightfully associate TBGA with the less commonly practiced assembly processes such as Tape Automated Bonding (TAB) and expensive gold bump process. This impression of TBGA repels end users and limits TBGA to mostly high end applications and a very narrow spectrum of lead counts. Times...

Plastic injection molding is discontinuous and a complicated process involving the interaction of several variables for control the quality of the molded parts. The goal of this research was to investigate the optimal parameter selection, the significant parameters, and the effect of the injection-molding parameters during the post-filling stage (packing pressure, packing time, mold temperature...

We compare the influence of different assembly sequences, process parameters and material properties on the resulting package and interposer warpage in 3D stacking configurations. To this end, extensive thermo-mechanical simulations were performed to conduct virtual design of experiments (DOEs) with variables such as substrate and molding material properties, component dimensions, process tempe...

Shrinkage and warpage is a leading fact in casting. It is common to compensate shrinkage by scaling the tool by a certain percentage. The transformed 3D CAD model of a final product is used for tool generation. The transformations of CAD model include 3D scaling or external surface offset. Both methods are proportional and uniform in all three axes, and they are already included in a vast varie...

Warpage of electronic packages is the result mismatch in coefficient thermal expansion (CTE) between silicon die (CTE = 2.6ppm/°C) and substrate 15–25 ppm/°C). In ultra-thin packages, reduced thicknesses can even higher package warpage due to flexural rigidity. Current approaches minimize include selecting constituent materials with lower CTE as well carrying out copper balancing metal layers w...