An investigation into the phonon contamination of X-ray sensitive superconducting tunnel junctions arising from the X-ray photoabsorption in various substrates has been conducted. Results are presented on the design of a superconducting tunnel junction (STJ) which substantially reduces or even eliminates phonon induced noise from the substrate. Such noise is the predominant feature in X-ray spe...

Several methods are presented for highly efficient calculation of substrate noise transport in integrated circuits. A three-dimensional Green’s function-based boundary element method, accelerated through use of the fast Fourier transform, allows the computation of sensitivities with respect to all substrate parameters at a considerably higher speed than any methods reported in the literature. S...

AbsfractWe describe a set of placement algorithms for handling substrate-coupled switching noise. A typical mixedsignal IC has both sensitive analog and noisy digital circuits, and the common substrate parasitically couples digital switching transients into the sensitive analog regions of the chip. To preserve the integrity of sensitive analog signals, it is thus necessary to electrically isola...

Coupling through common silicon substrate has become an important limiting factor in high-performance mixed-signal ICs. A study of the evolution of this type of interaction with technology scaling down is presented in this paper. The level of noise when devices and parasitic elements are scaled down is obtained for a typical situation. High performance and low power scaling scenarios are consid...

We investigate thermal noise mechanisms and present analytical expressions of the noise power spectral density at high frequencies (HF) in Silicon-on-insulator (SOI) MOSFETs. The developed HF noise model of RF T-gate body contact (TB) SOI MOSFET for 0.13-μm SOI CMOS technology accounts for the mechanisms of 1) channel thermal noise; 2) induced gate noise; 3) substrate resistance noise and 4) ga...

We analyze the Brownian thermal noise of a multilayer dielectric coating used in high-precision optical measurements, including interferometric gravitational-wave detectors. We assume the coating material to be isotropic, and therefore study thermal noises arising from shear and bulk losses of the coating materials. We show that coating noise arises not only from layer thickness fluctuations, b...

In this work, we demonstrate both experimentally and theoretically that the analog noise generation by a single enzymatic logic gate can be dramatically reduced to yield gate operation with virtually no input noise amplification. We demonstrate that when a cosubstrate with a much smaller affinity than the primary substrate is used, a negligible increase in the noise output from the logic gate i...

We study noise and noise energy of a high-Tc dc SQUID fabricated on a high-ǫR substrate whose conduction properties are given by transmission line physics. We show that transmission line resonances greatly enhance the noise. Remarkably, resistance asymmetry enhances these resonances even more. However, as the transfer function (dc dφ ) scales the same way, the noise energy is reduced by asymmet...

Efficient prediction of the substrate noise generated by large digital sections is currently a major challenge in System-on-a-Chip design. A macromodel to accurately and efficiently predict the substrate noise generated by digital standard cells is presented. The macromodel is generated from identification of the physical elements relevant to noise generation. Techniques to directly or indirect...

Noise caused by the activity of integrated circuits is a limiting factor for the development of future VLSI circuits. Transients of voltages and currents couple perturbations to the co-integrated circuits where the most effective medium to propagate noise is the silicon substrate. The effect is especially important where high-speed digital circuits are integrated together with highly sensitive ...