A model has been developed to predict the yield of solder flip-chip assemblies. Yield was found in relation to the mean and the standard deviation of the solder volume distribution, the assembly warpage, and the chip size. In this study, solder volume was represented by the diameters of the solder balls. The model identified failed joints using the Surface Evolver and a regression model. The re...

Articles you may be interested in Thermomigration and electromigration in Sn58Bi solder joints Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration Appl. Reliability of solder joints under Electromigration (EM) and Thermomigrati...

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The purpose of this study is to investigate the effects of reflow profile and thermal shock on the shear performance of eutectic SnPb (SnPb) and Sn3.0Ag0.5Cu (SAC305) solder joints. Test boards were assembled with four different sized surface mount chip resisto...

Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. So far, many papers have reported effects of cooling speed, type of solder pastes and solder fluxes o...

In order to successfully implement reliable Flip Chip packaging technology, it is desirable to ensure solder fatigue as the limiting mechanical failure mechanism. Doing so enables the packaging engineer to design to specific reliability standards, as solder fatigue is a known and predictable failure mechanism. Indeed, other Flip Chip failure modes such as silicon fracture and underfill delamina...

To improve the durability of lead free solder joints under high strain rates, such as drop and shock loading, some area array manufacturers have converted to low silver (Ag) content tin silver copper (SAC) solder spheres instead of the commonly accepted SAC305 solder. While the lower silver content SAC solder joints may address high strain rate shock loads, the durability of these joints under ...

Sn–9Zn solder joints containing Ag nano particles were prepared by mechanically mixing Ag nano particles (0.3, 0.5 and 1 wt%) with Sn–9Zn solder paste. In the monolithic Sn–Zn solder joints, scallop-shaped AuZn3 intermetallic compound layers were found at their interfaces. However, after the addition of Ag nano particles, an additional uniform AgZn3 intermetallic compound layer well adhered to ...

The presence of an 'underfill' encapsulant between a micro-electronic device and the underlying substrate is known to substantially improve the thermal fatigue life of flip-chip solder joints, primarily due to load-transfer from the solder to the encapsulant. In this study, a new single joint-shear (SJS) test, which allows the measurement of the strain response of an individual solder ball duri...

Solder joints are the main weak points of power modules used in harsh environments. For the power module of electric vehicles, the maximum operating temperature of a chip can reach 175 ◦C under driving conditions. Therefore, it is necessary to study the high-temperature reliability of solder joints. This study investigated the creep properties of Sn-3.0Ag-0.5Cu (SAC305) and Sn-8.0Sb-3.0Ag (SSA8...

The effect of Al on the corrosion resistance behaviour of Pb-free Sn–1.0Ag–0.5Cu–xAl solder (x 1⁄4 0.2 wt%, 0.5 wt% and 1.0 wt%) in 5% NaCl solution was investigated by using potentiodynamic polarization and salt spray exposure. Passivation behaviour was evident in all the solder formulations containing Al, compared to the base SAC solder. FESEM and XRD results revealed that more dense passive ...