Inkjet printing techniques for the etching of polymers and their application to the fabrication of organic electronic devices are reviewed. A mechanism is proposed for the formation of via holes in polymer layers through inkjet printing with solvent, and recent achievements in the fabrication with inkjet etching of various three-dimensional microstructures (i.e., microwells, microgrooves, hexag...

Admittance spectroscopy is employed to explain the property differences observe between organic thin film transistors (OTFTs) fabricated with various gate insulator layers based on poly(4-vinylphenol) (PVP) and poly(methyl methacrylate) (PMMA). The objective achieved through development of an equivalent circuit a compact analytical model device core structure, namely, metal–insulator–semiconduc...

Porous dielectrics such as SiCOH are used as the insulator in interconnect wiring in microelectronics devices to lower the dielectric constant and therefore decrease the resistive–capacitive delay. After etching a trench in low-k dielectrics in fluorocarbon plasmas, a CFx polymer remains on the sidewalls, which must be removed in a manner that does not damage the low-k material. This can be acc...

Nanoparticle-based polymer memory devices (PMDs) are a promising technology that could replace conventional silicon-based electronic memory, offering fast operating speeds, simple device structures and low costs. Here we report on the current state of nanoparticle PMDs and review some of the problems that are still present in the field. We also present new data regarding the charging of gold na...

We suggest that highly conducting oriented polymers with a fibril structure can be modeled by a regular lattice of disordered metallic wires with a random first-neighbor interwire coupling which mimics the cross-links between fibrils. We show that such a model can be described by a non-linear sigma model. Within a one-loop self-consistent approximation, we determine the position of the metal-in...

In conductor-insulator nanocomposites in which conducting fillers are dispersed in an insulating matrix, the electrical connectedness is established by inter-particle tunneling or hopping processes. These systems are intrinsically non-percolative and a coherent description of the functional dependence of the conductivity σ on the filler properties, and in particular of the conductor-insulator t...