The EMC-adequate design of microelectronic systems includes all actions intended to eliminate electromagnetic interference in electronic systems. Challenges faced in the microelectronic area include growing system complexity, higher operating speed, denser design at all levels of integration (chip, printed circuit board, MCM and system). Growing complexity, denser design and higher speed all le...

We present a robust and simple method for direct, label-free PCR product quantification using an integrated microelectronic sensor. The field-effect sensor can sequentially detect the intrinsic charge of multiple unprocessed PCR products and does not require sample processing or additional reagents in the PCR mixture. The sensor measures nucleic acid concentration in the PCR relevant range and ...

We describe our experiences in using microelectronic design projects as cooperative education experiences for electrical engineering majors. We discuss funding of the necessary VLSI design laboratory and describe our course offerings. We believe our “alternative co-op” program is of value to VLSI educators with limited resources who are looking for ways to provide students with an alternative t...

The need for reduced time to market of new designs has mandated the development of a new generation of computer-aided design tools and design methodologies. The active pursuit of a substantial time reduction in the design process is encompassed in rapid system prototyping. This chapter introduces the eld and the disciplines it comprises, and presents extensive examples of research activities in...

Copper wire bonding of microelectronic parts has developed as a means to cut the costs of using the more mature technology of gold wire bonding. However, with this new technology, changes in the bonding processes as well as bonding metallurgy can affect product reliability. This paper discusses the challenges associated with copper wire bonding and the solutions that the industry has been imple...