Soldering failures lead to considerable manufacturing costs in the electronics assembly industry. Soldering problems can be caused by improper parameter settings during paste stencil printing, component placement, the solder reflow process or combinations thereof in surface mount assembly (SMA). Data mining has emerged as one of the most dynamic fields in processing large manufacturing database...

This study investigated the feasibility of bonding layers of porcine small intestinal submucosa (SIS, Cook Biotech, Inc.) with a light-activated protein solder. SIS is an acellular, collagen-based extracellular matrix material that is approximately 100 microns thick. The solder consists of bovine serum albumin and indocyanine green dye (ICG) in deionized water. The solder is activated by an 808...

Soldering of molded case tantalum capacitors can result in damage to Ta2O5 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture co...

Title of Document: CHARACTERIZATION OF FR-4 PRINTED CIRCUIT BOARD LAMINATES BEFORE AND AFTER EXPOSURE TO LEAD-FREE SOLDERING CONDITIONS Ravikumar Sanapala, Master of Science, 2008 Directed By: Chair Professor, Michael G. Pecht, Department of Mechanical Engineering The transition to lead-free soldering of printed circuit boards (PCBs) using solder alloys such as Sn/Ag/Cu has resulted in higher t...

Laser micromachining by ablation is an established technique for the production of 2.5D and 3D features in a wide variety of materials. Mask projection techniques using excimer lasers have been used to fabricate microstructures on large panels where diamond turning and reflow techniques have reached their limits. We have developed 3D structuring tools based upon UV laser ablation of polymers to...