This paper presents details on ultra thin (silicon dioxide and silicon nitride based composite structures) dielectrics that have the potential for meeting future device requirements. The increase in gate leakage current is a major problem for scaled conventional gate oxide in advanced device technology. Approaches to minimize this problems have been reviewed. Various Gate, Interlayer and DRAM d...

The design of custom integrated circuits is an instance of the more general problem of the design of complex systems. Certainly if circuits are to be designed that contain between half a million and a million transistors, then techniques for the design of complex systems must be introduced that will assure quick, correct, and economical construction of the fabricated circuits. The established m...

This project is devoted to the study of fundamental techniques used in the development of both algorithms and representations for the conversion of functional specifications to custom integrated circuit layout specifications. Included in this area are five major areas of investigation. These are the development of functional specification languages, the development and utilization of architectu...

Optomechanical circuits are a promising candidate to realize various signal processing functions on a chip. In this paper we review several different NOMS structures fabricated in a silicon-on-insulator platform. © 2010 Optical society of America OCIS-codes: (130.3120) Integrated optics devices; (250.4745) Optomechanics

integrated circuits A. W. Topol D. C. La Tulipe, Jr. L. Shi D. J. Frank K. Bernstein S. E. Steen A. Kumar G. U. Singco A. M. Young K. W. Guarini M. Ieong Three-dimensional (3D) integrated circuits (ICs), which contain multiple layers of active devices, have the potential to dramatically enhance chip performance, functionality, and device packing density. They also provide for microchip architec...

Contention resolution and forwarding of labeled optical packets at 40 Gb/s is demonstrated utilizing multiple InP based optical buffers and monolithic wavelength converters. Layer-2 packet recovery measurements are presented. ©2009 Optical Society of America OCIS codes: (060.1810) Buffers, couplers, routers, switches, and multiplexers; (060.6719) Switching, packet

The ability to integrate micro-optical elements with movable structures and microactuators has opened up many new opportunities for optical and optoelectronic systemsI2. It allows us to manipulate optical beams more effectively than conventional methods, and is scalable to large optical systems. Optical MEMS (MicroElectroMechanical Systems) have applications in display, sensing, and optical dat...