In this study, electrodes on a exible printed circuit board (FPCB) and rigid printed circuit board (RPCB) were bonded together by thermo-compression (TC) bonding, using a Sn-3.0Ag-0.5Cu solder as an interlayer. In order to investigate the hygrothermal reliability of the TC bonded FPCB/RPCB joints, a temperature-humidity (TH) test of 85°C/85% relative humidity, and a 90° peel test, were conducte...

Hygrothermal aging of neat poly(3-hydroxybutyrate-co-3-hydroxyvalerate) (PHBV) and PHBV filled with an organomodified montmorillonite (C30B) at 3wt. was investigated 65°C 100% relative humidity (RH) up to 100 days. FT-IR data indicated that the carbonyl intensity index decreased exposure time for both samples, while main degradation mechanism occurred through hydrolysis reaction. This led chain...

We investigated the effects of hygrothermal aging on the tension–tension fatigue behavior of unidirectional (UD) glass/polydicyclopentadiene (pDCPD) composites. Samples were immersed in deionized (DI) water and salt water, and glass/epoxy composites were used as a benchmark for comparison. Composites of pDCPD showed less water uptake and superior fatigue performance compared to similarly aged e...

Although implicit methods require extra calculation, they have been largely used for obtaining numerical approximations of time-dependent differential conservation equations in the building science domain, thanks to their stability conditions that enable the use of larger time steps. Nevertheless, they require important sub-iterations when dealing with highly nonlinear problems such as the comb...

Fiber-reinforced composite laminates are often used in severe environments such as high temperature and humidity conditions. Therefore, it is of practical interest to establish a simple but robust method to determine material properties that define the hygrothermal behavior of composites under various conditions. In this article a novel inverse analysis approach is presented to identify the dif...