Characterization of Cu/diamond interface thermal conductance (hc) and an improved understanding of factors affecting it are important, as Cu-diamond composites are increasingly being considered for electronic packaging applications. In this study, ~90 nm thick Cu layer was deposited on synthetic as well as natural diamond substrates. In several specimens, a Ti-interface layer of thickness ≤ 3.5...

Magnetoelectric (ME) interaction in magnetostrictive-piezoelectric multiferroic structures consists in inducing the electric field across the structure in an applied magnetic field and is a product property of magnetostriction and piezoelectricity in components. ME voltage coefficient that is the ratio of induced electric field to applied magnetic field is the key parameter of ME coupling stren...

Waveguide bends pose a problem for high-voltage uh.ra-wideband (UWB) systems or for any tr.ansmission-line system with low-loss/fast-risetime requirements, since only a straight section of conventional transmission line can support the pure TEM mode necessary to preserve the risetime of a transmitted pulse. Here we consider alternative concepts for compensation of waveguide bends. One concept, ...

0