Multimaterial 3D printing in electronics is expanding due to the ability realize geometrically complex systems with simplified processes compared conventional printed circuit board. Herein, feasibility of using a copper-based filament circuits planar and vertical interconnections presented. The resistivity tracks (1–3 mm wide) studied reference parameters orientation. Using lateral infill for 1...

Thermoreversible hydrogels are widely used in foods, drug delivery and tissue engineering. Novel shapes/textures out of them being increasingly fabricated using Fused Deposition Modelling (FDM) type 3D printing, where gels extruded layer-by-layer above their gelling temperature followed by cooling. It is crucial to develop a library suitable materials optimise printing conditions ensure good pr...