In the previous chapter, the components of electroless nickel plating baths were discussed from the viewpoint of the function each performs in the bath, with little attention paid to their effect on the plating process. The metal and the electron source (the reducing agent) are consumed in the electroless plating reaction and so their concentrations in the bath are continuously decreasing. Ther...

Sodium-ion batteries (SIBs) are emerging as potential stationary energy storage devices due to the abundance and low cost of sodium. A simple and energy efficient strategy to develop electrodes for SIBs with a high charge/discharge rate is highly desirable. Here we demonstrate that by surface modification of Ge, using electroless deposition in SbCl3/ionic liquids, the stability and performance ...

Cu-filled TSV (through silicon via) is important technology for 3-D LSIs in order to obtain higher packing density, faster signal transmission, and lower power consumption. Diameter of TSV is expected to be smaller than 2 μm, and its aspect ratio to be larger than 10 in near future [1]. For realizing a high aspect ratio Cu-filled TSV, it is essentially important to form the barrier and seed lay...

Conductive nanotubes consisting of indium tin oxide (ITO) were fabricated by electroless deposition using ion track etched polycarbonate templates. To produce nanotubes (NTs) with thin walls and small surface roughness, the tubes were generated by a multi-step procedure under aqueous conditions. The approach reported below yields open end nanotubes with well defined outer diameter and wall thic...

Careful preparation and cleaning of various types of components is indispensable prior to their surface treatment or final assembly. Various surface treatment operations that require such care include vacuum deposition, electrodeposition, electroless deposition, various dip coatings, etc. Surface preparation is essential for achieving good and firmly adhered coatings. Trace of residual surface ...

Dome-shaped gold nanoparticles (with an average diameter of 10.5 nm) are grown on H-terminated Si(100) substrates by simple techniques involving electro- and electroless deposition from a 0.05 mM AuCl3 and 0.1 M NaClO4 solution. XPS depth profiling data (involving Au 4f core-level and valence band spectra) reveal for the first time the formation of gold silicide at the interface between the Au ...

Free standing and vertically aligned silicon rice-straw- like array emitters were fabricated by modified electroless metal deposition (EMD), using HF-H(2)O(2) as an etching solution to reduce the emitter density and to make the emitter end of the formed silicon rice-straw arrays shaper than those formed by conventional EMD. These silicon rice-straw array emitters can be turned on at E(0) = 4.7 ...

this paper focused on a novel method of electroless plating ruthenium (ru) on solid or porous substrates like porous stainless steel (pss) discs or ceramic tubes. a novel complexing plating bath of ru was developed. it is proven that ru can be deposited directly on these substrates by the bath at a temperature of 328 k and strong alkaline environment. tga, sem, edx and xrd confirmed the success...