An ultrasound-assisted activation method for electroless silver plating is presented in this study. When the ultrasound was applied during the activation step, the amount of the Pd species adsorbed on substrate surfaces was higher than that of sample pretreated with a conventional activation process without ultrasound irradiation. With this activation method, it was also shown that the adsorbed...

The use of magnesium alloys is limited due to their susceptibility to corrosion although they have many attractive physical and mechanical properties. To increase mechanical and corrosion properties of these alloys, many deposition method and coating types are used. Electroless Ni–B coatings have received considerable interest recently due to its unique properties such as cost-effectiveness, th...

A palladium composite membrane was prepared by electroless plating on oxidized porous stainless steel support (ox-PSS). Hydrogen permeation flux through this composite membrane was measured in the temperature range of 574-674K and the pressure difference of two sides of membrane up to 90kPa. A simplified resistance model was employed to analyze the permeation behavior of hydrogen through Pd/ox-...

For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto the surface of the AI bondpads of the die is the first step in the wafer bumping process. The UBM is necessary, as the fragile AI pad has a tenacious oxide layer that cannot be soldered without the use of strong fluxes and a barrier layer is required to prevent dissolution of the bondpad into the...