Miniaturization of electronics to nanoscale leads to significantly higher current density levels and larger thermal gradients in electronics packaging. Laboratory test data show that thermomigration plays a significant role in high current density induced failure in solder joints and interconnects. In this paper, a computational damage mechanics model for thermomigration process is proposed and...

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Anisotropic creep-damage modeling has become an increasingly important prediction technique in both the aerospace and industrial gas turbine industries. The introduction of tensorial damage mechanics formulations in modeling tertiary creep behavior has lead to improved predictions of the creep strain that develops due to anisotropic grain structures and the induced anisotropy that occurs with i...

Electromigration is a major road block in the pursuit of nanoelectronics and next generation power electronics. The current density in the state-of-the-art microelectronics solder joints is about 10 A/cm. In the next generation nanoelectronics solder joints this current density is expected to increase by an order of magnitude, at least. In this paper, a new damage mechanics formulation is imple...

This paper reviews recent research on cement based composites design for damage tolerance. Specific focus is placed on the influence of fiber and interface properties on the complementary energy of the composite crack bridging behavior, which in turn governs the mechanics of composite fracture. The theoretical concepts are illustrated with examples of highly damage tolerant cement based composi...

1. Basic Results in Continuum Mechanics 1.1. Kinematics 1.2. Stress Tensors and Balance of Momenta 1.3. Energy Balance Principle and Entropy Inequality 1.4. Fundamental Principles of Constitutive Models 2. Elastic and Hyperelastic Materials 2.1. Isotropic Hyperelastic Materials 2.2. Constitutive Models for Fiber-Reinforced Hyperelastic Materials 2.3. Examples of Numerical Applications 3. Elasto...