The well-established killing of bacteria by copper surfaces, also called contact killing, is currently believed to be a combined effect of bacterial contact with the copper surface and the dissolution of copper, resulting in lethal bacterial damage. Iron can similarly be released in ionic form from iron surfaces and would thus be expected to also exhibit contact killing, although essentially no...

The effects of copper on the ageing precipitation behavior of as-quenched and pre-aged AA6016 aluminum alloy were studied by differential scanning calorimetry (DSC), Vickers hardness measurement and transmission electronic microscopy (TEM). The results indicate that the addition of copper facilitates the growth of clusters (GP I) to the critical size during pre-ageing. Therefore, the addition o...

Measurements of microwave attenuation at room temperature and 4.2 K have been performed on some conductors commonly used in receiver input circuits. The reduction in loss on cooling is substantial, particularly for copper and plated gold, both of which showed a factor of 3 loss reduction. Copper passivated with benzotriazole shows the same loss as without passivation. The residual resistivity r...

The solidification paths of the Al86.1Mn2.5Be11.4 and Al84Mn5.1Be10.9 alloys, melt spun, cast into a copper mould and controlled cooled (during DSC) were investigated by means of light-optical microscopy (LOM), differential scanning calorimetry (DSC) combined with thermogravimetry (TG) or simultaneous thermal analysis (STA), scanning electron microscopy (SEM), transmission electron microscopy (...

The possibility of alloying can not be avoided at the interface between molten brazing filler metal and base metal in brazing, so the wettability of brazing filler metal can not be easily explained theoretically. We used the original apparatus for wettability test and investigated the relation between the wettability of brazing filler metals of Ag-P-Cu and Ag-Cu-Zn-Cd systems on copper and the ...

A discontinuously reinforced MMC containing 12 vol % Sic particles in an Al-Cu-Mg alloy (AA 2124) matrix has been diffusion bonded. Thick interlayers of different superplastic aluminium alloys (Al-Li 8090 and A1-Cu SUPRAL) were used to reduce the bonding pressure and ensure complete surface contact. Microstructural studies shown higher continuity in joints bonded with 8090 interlayer than with ...

as ferromagnetic alloys composed exclusively of non magnetic elements. However, the electrical properties of the alloys have not been studied in details. The purpose of the present report is to present our data on the electrical resistivity of an In-Heusler Cu2.0Mn0.94In1.0 single crystal. The purities of the elements used are 99.9% for electrolytic manganese, 99.9% for oxygen free copper plate...