in this paper the changes in the heat capacity of cooling towers has been investigated as a result of injecting combustion products of boilers. in the tower, the air is re-heated through mixing with hot flue gas after passing through the heat exchangers. as a result of this process, the draft of the cooling tower is increased. the additional produced draft depends on the ambient temperature and...

Chemical mechanical polishing (CMP) is an essential planarization process for semiconductor manufacturing. The application of CMP has been increasing in fabrication highly integrated devices. Recently, environmental burden caused by the was assessed because interest global environment. In this study, previously reported impacts on environment and studies conducted developing various methods to ...

The present paper describes the designing of a thermally and economically optimum mechanical draft counter-flow wet cooling tower. The design model allows the use of a variety of packing materials in the cooling tower toward optimizing heat transfer. Once the optimum packing type is chosen, a compact cooling tower with low fan power consumption is modelled within the known design variables....

Chemical mechanical polishing (CMP) is a key process enabling shallow trench isolation (STI), which is used in current integrated circuit manufacturing processes to achieve device isolation. Excessive dishing and erosion in STI CMP processes, however, create device yield concerns. This thesis proposes characterization and modeling techniques to address a variety of concerns in STI CMP. Three ma...

This paper presents a universal engineering model, which can be used to formulate both counterflow and crossflow cooling towers. By using fundamental laws of mass and energy balance, the effectiveness of heat exchange is approximated by a second order polynomial equation. Gauss-Newton and Levenberg-Marquardt methods are then used to determine the coefficients from manufactures data. Compared wi...