A series of mixed crystals composed of Cu(2)ZnSnS(4), Ag(2)ZnSnS(4) and ZnS was prepared by co-precipitation of the corresponding metal ions in aqueous sodium sulfide followed by annealing in a sulfur atmosphere. Ideal solid solutions of Cu(2)ZnSnS(4) and Ag(2)ZnSnS(4) with a kesterite structure ((Cu(x)Ag(1-x))(2)ZnSnS(4) (0 ≤x≤ 1)) were successfully obtained by this procedure, as confirmed by ...

The influence of Cu, Ag, and Au additives on the L10 ordering, texture, and grain size of FePt thin films has been examined. Lattice parameter data indicated that Au and Ag additives tended to segregate from FePt, but Cu alloyed with FePt. FePt films with Au or Ag additive showed 1–2 kOe higher coercivity values compared to a pure FePt film after annealing at 450 °C and above for 10 min. The ad...

The periplasmic protein CusF, as a part of the CusCFBA efflux complex, plays a role in resistance to elevated levels of copper and silver in Escherichia coli. Although homologues have been identified in other Gram-negative bacteria, the substrate of CusF and its precise role in metal resistance have not been described. Here, isothermal titration calorimetry (ITC) was used to demonstrate that Cu...

In this study, Cu, Ag, and Fe nanoparticles (NPs) are used in shampoo, hand washing liquid (HWL) and dish washing liquid (DWL) instead of the conventional synthetic preservatives such as isothiazolinones; since the latter often act as potent sensitizers that leads to development of allergic contact dermatitis. The above NPs are considerably effective against Escherichia coli and Staphylococcus ...

Silver and copper nanoparticles were produced by chemical reduction of their respective nitrates by ascorbic acid in the presence of chitosan using microwave heating. Particle size was shown to increase by increasing the concentration of nitrate and reducing the chitosan concentration. Surface zeta potentials were positive for all nanoparticles produced and these varied from 27.8 to 33.8 mV. An...

The microstructure, precipitation kinetics, electrical conductivity, and mechanical properties of Cu-7.9 wt%Ag Cu-5.8 doped with 0.6 wt%Nb were investigated. As-cast microstructure revealed both discontinuous continuous Ag in Cu matrix. Differential scanning calorimetry data indicated that occurred at higher temperatures activation energy. Both micro-sized nano-sized Nb particles observed the N...

The electrical conductivity of pure Cu powder is typically deteriorated at elevated temperatures due to the oxidation by forming non-conducting oxides on surface, while enhancing oxidation resistance via alloying is often accompanied by a drastic decline of electrical conductivity. Obtaining Cu powder with both a high electrical conductivity and a high oxidation resistance represents one of the...

Lead-free soldering for electronic industry is a segment of global trend toward lead-free environment. Although initiated in U.S. in early 1990’s, it advanced much more rapidly in Japan and Europe. This differentiation in Pb-free progress triggered great concerns of users of Pb-containing solders about maintaining business opportunity, therefore further expedites the advancement of Pb-free sold...

Antimicrobial nanobunches with different amounts of chitosan-capped Ag were prepared by continuous gas-liquid green route under ultrasound irradiation. Spark-produced aerosol Cu nanoparticles were directly injected into an ultrasound Ag(I)-chitosan reaction cell for efficient hydrosolization of the Cu particles and the subsequent incorporation of Ag and chitosan on Cu. Subsequently, electrospra...