Phase-stepping technique is applied to the analysis of fringe pattern images of BGAs (Ball Grid Arrays) obtained by shadow moiré. Sensitivity of the fringe pattern analysis is demonstrated to be significantly increased. Thermally induced warpage of BGAs is successfully measured in real-time as the sample is driven through a simulated reflow process. The paper discusses the technique of phase st...

In the past few years, many studies have reported on the formula of solder metal alloy materials. This paper discusses the influence of organic materials characters, the decomposing rate of flux in lead-free solder paste and coefficients of thermal expansion (CTE) of halogen-free mold compounds during the on-board reliability test, and the failure mechanism in both 63Sn/37Pb and Sn–3.5Ag–0.5Cu ...

1 AAN013 shear rate behavior. For example, gauge variation can be caused by variable post-extrusion die swell, and warpage can occur from non-uniform relaxation during cooling of an improperly formulated injection molding compound. Also, by testing at low enough shear rates so that the measurements are in the melt’s linear viscoelastic region, the data can be linked directly to the polymer’s mo...

Abstract ETS (Embedded trace substrate) has become as the mainstream substrate for FCCSP since it fine trace, better dimension control and low cost advantages which compared to normal substrate. But usually encountered more serious warpage issue bare complete package may influence D/B (die bonding) SMT yield rate due its coreless characteristic. Especially with special pattern design (ex. large...

In this study, injection molding of three poly lactic acid (PLA) based bone screws was simulated and optimized through minimizing the shrinkage and warpage of the bone screws. The optimization was carried out by investigating the process factors such as coolant temperature, mold temperature, melt temperature, packing time, injection time, and packing pressure. A response surface methodology (RS...