We describe a model for non-convecting diffusion-controlled solidification of a ternary (three-component) alloy cooled from below at a planar boundary. The modelling extends previous theory for binary alloy solidification by including a conservation equation for the additional solute component and coupling the conservation equations for heat and species to equilibrium relations from the ternary...

Aluminum alloy welding suffers from problems such as solidification cracking and hydrogen-induced porosity, which are sufficiently severe to limit its potential applications. Because mitigated porosity incidence and solidification cracking are observed in aluminum welds using double pulsed gas metal arc welding (DP-GMAW), a comprehensive review of the mechanism is necessary, but absent from the...

Casting solidification brings to the shrinkage in the liquid state, solidification shrinkage and shrinkage in the solid state. Recently, technologies of die and gravity casting have increased the number of highly functional castings, which have been characterized with the very complex geometry. due to the different wall thickness in these castings, as well as the high solidification rates, prem...

This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, the eutectic Sn-3.5%Ag, and its composite counterparts. Direct temperature recordings for the no-clean solder paste during the simulated reflow process revealed a significant amount of undercooling to occur prior to the initiation of solidification of the eutectic Sn-3.5%Ag solder, which is 6.5 C, ...

Monomethoxypoly(ethylene glycol)-b-poly(DL-lactide) copolymer (PELA) microparticles loading lysozyme were prepared through a modified W/O/W double emulsion-solvent diffusion method using ethyl acetate (EA) as organic solvent. The modified process was divided into five steps: (1) primary emulsification (W1/O), (2) re-emulsification (W1/O/W2), (3) pre-solidification, (4) solidification and (5) pu...

We present a new 2D phase-field model with anisotropy, applied to the dynamics and structure of free dendrite growth during solidification process of binary alloys under the action of magnetic field. The physics of solidification problem of Ni-Cu alloy such as conditions for crystal growth rate are discussed and show good qualitative agreement with numerical simulations. In order to improve the...

DTA analysis was used to investigate the solidification reactions of alloy A319 with either 12 or 136 ppm of Sr added. Strontium does not affect primary solidification of (Al) dendrites but modifies the kinetics of the (Al)–Si eutectic. The effects of Sr level and of cooling rate on the characteristic temperatures for the (Al)–Si and other eutectic reactions are described.

The primary factors that effect solid state diffusion during solidification are described and binary solute redistribution equations that permit estimation of the significance of solid state diffusion are discussed. Model calculations suggest that solid state diffusion of substitutional alloying elements in FCC alloys is insignificant under most processing conditions, while that of interstitial...