The suspended electrothermal polysilicon micro beams generate displacements and forces by thermal buckling effects. In the previous electro-thermal and thermo-elastic models of suspended polysilicon micro beams, the thermo-mechanical properties of polysilicon have been considered constant over a wide rang of temperature (20900°C). In reality, the thermo-mechanical properties of polysilicon depe...

This paper presents a single wafer, all-silicon, high aspect-ratio multi-layer polysilicon micromachining technology that combines deep dry etching of silicon with conventional surface micromachining to realize tens to hundreds of microns thick, high aspect-ratio, electrically isolated polysilicon structures with sub-micron air-gaps. Vertical polysilicon sense electrodes as tall as the main bod...

Inorganic–organic hybrid structures have become innovative alternatives for next-generation dye-sensitized solar cells, because they combine the advantages of both systems. Here, we introduce a layered sandwich-type architecture, the core of which comprises a bicontinuous three-dimensional nanocomposite of mesoporous (mp)-TiO2, with CH3NH3PbI3 perovskite as light harvester, as well as a polymer...

A new polysilicon bridge-slider structure (Fig. 1), in which one end of the bridge is fixed and the other is connected to a plate sliding in two flanged guideways, is designed and fabricated to study the strain at fracture of LPCVD polysilicon. In the experiments, a mechanical probe is used to push against the plate end, compressing and forcing the bridge to buckle until it breaks. The distance...

a  commercial  ti-nanoxide  was  deposited  on  in-doped  sno2 (ito) polymer  substrates by  tape casting  technique with different thicknesses  (7,  14  and  36μm)  to  be  used  as  photoelectrode  in flexible  dye-sensitized  solar  cells  (dsscs).  ruthenium  dye  was adsorbed on each tio2 film for 24 h. the resulting photoelectrodes were used to form flexible dsscs in combination with elec...

The suitability of polysilicon as a material for the fabrication of interdigitated electrodes and their application to the development of sensors is studied in this work. The main interest in using this material lies in the possibility of obtaining integrated sensors with commercial CMOS technologies and simple post-processing steps. Electrodes with 3μm finger width and 3, 10, and 20μm spacing ...

Polysilicon thick films have been found to be an irreplaceable option in various sensors and other microelectromechanical system (MEMS)-designs. Polysilicon is also a prospective option for replacing singlecrystal silicon in customized silicon-on-insulator-substrates. Due to the nature of polysilicon, bonding for MEMS-purposes has so far concentrated on anodic bonding, which has drawbacks for i...