In this work, a library of 3D lumped components completely embedded in the thinnest, multilayer liquid crystal polymer (M-LCP) stack-up with four metallization layers and 100μm of total thickness, is reported for the first time. A vertically and horizontally interdigitated capacitor, realized in this stack-up, provides higher self resonant frequency as compared to a similarly sized conventional...

The well-known electro-mechanical analogy that equates current, voltage, resistance, inductance and capacitance to force, velocity, damping, spring constant and mass has a shortcoming in that mass can only be used to simulate a capacitor which has one terminal connected to ground. A new model that was previously proposed by the authors that combines a mass with a pulley (MP) is shown to simulat...

The well-known electro-mechanical analogy that equates current, voltage, resistance, inductance and capacitance to force, velocity, damping, spring constant and mass has a shortcoming in that mass can only be used to simulate a capacitor which has one terminal connected to ground. A new model that was previously proposed by the authors that combines a mass with a pulley (MP) is shown to simulat...

The development of a microfluidically cryo-cooled and inductively coupled spiral microcoil for magnetic resonance (MR) microscopy with high signal-to-noise ratio (SNR) is presented. The microcoil was inductively coupled to a secondary coil that was directly coupled to a transmission line. This configuration eliminated thermal flux through direct connection when the microcoil was cryo-cooled to ...

The pull-in voltage of a parallel plate electrostatic transducer is used to determine the amount of over-etching in fabricated devices. A detailed analysis of the capacitor behaviour over the full displacement range yields a model, which is used to describe the relation between over-etching and measured pull-in voltage. SEM photos confirm the over-etching measurement based on pull-in voltage. T...

This paper studies the principle of a novel voltage step-up converter based on a micromachined variable parallel-plate capacitor in combination with an electrostatic actuator. Electrical equivalent circuit and system-level SIMULINK models have been developed. Based on these models, an analysis of design parameters and expected device performance has been performed to serve as a starting point f...

Theoretical limits for the capacitance density of integrated capacitors with combined lateral and vertical field components are derived. These limits are used to investigate the efficiency of various capacitive structures such as lateral flux and quasifractal capacitors. This study leads to two new capacitor structures with high lateral-field efficiencies. These new capacitors demonstrate large...

The capacitance of the circular parallel plate capacitor is calculated by expanding the solution to the Love integral equation into a Fourier cosine series. Previously, this kind of expansion has been carried out numerically, resulting in accuracy problems at small plate separations. We show that this bottleneck can be alleviated, by calculating all expansion integrals analytically in terms of ...

We describe resonant capacitive MEMS transducers developed for use as acoustic emission detectors, fabricated in the commercial three-layer polysilicon surface micromachining process (MUMPs). The 1-cm square device contains six independent transducers in the frequency range between 100 kHz and 500 kHz, and a seventh transducer at 1 MHz. Each transducer is a parallel plate capacitor with one pla...

Parasitic inductance cancellation is applied to a surface mount shunt capacitor that is connected through a screw to a chassis ground plate separate from the reference planes of the PCB. This filter is demonstrated to have considerably better filtering performance than a comparable conventional shunt capacitor arrangement from 60 MHz to 800 MHz in a 50-Ω system.