Abstract: Nickel was electrodeposited onto copper substrates with high {111} and {400} peak intensities. The grain size of coatings deposited onto the copper substrate with a higher {111} peak intensity was finer. Spheroidized pyramid morphology was obtained at low current densities on both copper substrates. By increasing the deposition current density, grain size of the coating was increased ...

AbsfractWe describe a set of placement algorithms for handling substrate-coupled switching noise. A typical mixedsignal IC has both sensitive analog and noisy digital circuits, and the common substrate parasitically couples digital switching transients into the sensitive analog regions of the chip. To preserve the integrity of sensitive analog signals, it is thus necessary to electrically isola...

Techniques are presented to compactly represent substrate noise currents injected by digital networks. Using device-level simulation, every gate in a given library is modeled by means of the signal waveform it injects into the substrate, depending on its input transition scheme. For a given sequence of input vectors, the switching activity of every node in the Boolean network is computed. Assum...

Digital switching noise is of major concern in mixed-signal circuits due to thecoupling of the noise via a shared substrate to the analog circuits. A signifi-cant noise source in this context is the digital clock network that generally hasa high switching activity. There is a large capacitive coupling between theclock network and the substrate. Switching of the clock produces cu...

This paper presents an efficient modeling method, based on the microstrip lines theory, for the coupling between a substrate backplane and a device contact. We derive simple closed-form formulas for rapid extraction of substrate parasitic. We use these formulas to model spiral inductors as important substrate-noise sources in mixed-signal systems. The proposed model is verified for the frequenc...