With the recent advances in microelectronic fabrication technology, it becomes now possible to fabricate thin imagers, less than half a millimeter thick. Dubbed TOMBO (an acronym for thin observation module by bound optics), a thin camera-on-a-chip integrates micro-optics and photo-sensing elements, together with advanced processing circuitry, all on a single silicon chip. Modeled after the com...

This paper examines the apparent limits, possible extensions, and applications of CMOS technology in the nanometer regime. Starting from device scaling theory and current industry projections, we analyze the achievable performance and possible limits of CMOS technology from the point of view of device physics, device technology, and power consumption. Various possible extensions to the basic lo...

The content of this thesis is oriented on the R&D of microelectronic integrated circuits for processing the signal from particle sensors and partially on the sensors themselves. This work is motivated by ongoing upgrades of the ATLAS Pixel Detector at CERN laboratory and by exploration of new technologies for the future experiments in particle physics. Evolution of technologies for the fabricat...

Inequalities in thermomechanical properties of materials at interfaces of a modern package lead to a rise in periodic stresses during normal operation, making these sites crucial to the integrity of the entire product. Proper lifetime analysis for highly miniaturized interconnects is a real challenge. In addition, broad application of 100% quality standards in various industries has caused a ra...

Microelectronic control of drug delivery devices enables precise management of drug delivery profiles. Iontophoresis patches offer microelectronic control over delivery in a noninvasive manner, but these are limited to the administration of relatively small molecules at small doses. Infusion pumps are widely used for delivery of insulin and other drugs; however, they require an invasive cathete...

Experiments have been performed to assess the feasibility of cooling microelectronic components by means of single-phase and two-phase forced convection. Tests were conducted using a single heat source flush mounted to one wall of a vertical rectangular channel. An inert fluorocarbon liquid (FC-72) was circulated upward through the channel at velocities up to 4.1 m/s and with subcooling up to 4...