The objective of this project was to create microelectromechanical systems (MEMS) using paper as the substrate and piezoresistive carbon ink to create a device that was sensitive to force. The idea behind this approach was to minimize cost and maximize ease of production. To achieve our objective, we used a paper cantilever design to correlate the relationship between force and change in resist...

The paper is based on determining the reaction pressure on the diaphragm of a condenser microphone by integrating numerically the frequency domain Stokes system describing the velocity and the pressure in the air domain beneath the diaphragm. Afterwards, the membrane displacement can be obtained analytically or numerically. The method is general and can be applied to any geometry of the backpla...

A microphone is a transducer that converts acoustic energy into electrical energy. Microphones are widely used in voice communications devices, hearing aids, surveillance and military aims, ultrasonic and acoustic distinction under water, and noise and vibration control (Ma et al. 2002). Micromachining technology has been used to design and fabricate various silicon microphones. Among them, the...

Combining the impact-echo (IE) method with air-coupled sensors has high potential to implement an efficient non-destructive testing system for concrete structures. By using microphones as sensors air-coupled IE offers significant advantages in terms of equipment costs and acquisition speed since no direct coupling of delicate and expensive contact-transducers is necessary. However, problems rel...

Instead of the conventional use micro-electro-mechanical system (MEMS) hotplate for metal oxide semiconductor (MOS) or nondispersive infrared (NDIR) gas sensing, it was used photoacoustic (PA) sensing. A low-cost MEMS microphone development this PA carbon dioxide (CO 2 ) sensor. To knowledge authors, is first time that a and are combined in sensing with high modulation frequency. NDIR sensors m...

This Special Issue is composed by seven papers, selected and expanded from the contributions presented at the 2014 DTIP Symposium on MEMS and MOEMS (Design, Test, Integration & Packaging of MEMS/MOEMS), held in Cannes, Cote d’Azur on 1–4 April 2014. It was a successful experience in the now long history of the DTIP Symposium, chaired by Bernard COURTOIS, CMP, Grenoble, France, with the signific...