The effects of a third element, namely silver, copper, zinc, or antimony, on the microstructure and mechanical properties of eutectic tin-bismuth (Sn–Bi) solder were investigated. The investigation showed that, except for zinc, the addition of a trace amount of the third element improves the ductility of the Sn–Bi solder owing to the formation of a fine, homogeneous ternary eutectic microstruct...
