نتایج جستجو برای: hyrogen bonding

تعداد نتایج: 43815  

Barakatin, Mehrdad, Farjampour, Paria, Malekypour, Mohammad Reza,

Shear bond strength of dentin bonding agents to coronal and radicular dentin Dr. M. Barakatin * - Dr. MR. Malekypour * - Dr. P. Farjampour ** *Assistant Professor of Operative Dentistry & Dental Materials Dept., Faculty of Dentistry, Azad University (Khorasgan). ** Dentist. Abstract Background and Aim: The purpose of this study was to compare the shear bond strength of three bonding agents know...

Kasraie, Shahin, Masoum, Tahereh, Nafarie, Maryam,

An in vitro study of wet-bonding fissure sealant micro-leakage (Embrace) Dr. T. Masoum *- Dr. SH. Kasraie ** - Dr. M. Nafarie *** *Assistant Professor of Pedodontics Dept., Faculty of Dentistry, Hamedan University of Medical Sciences. **Assistant Professor of Operative Dentistry Dept., Faculty of Dentistry, Hamedan University of Medical Sciences. *** Dentist. Abstract Background and Aim: It has...

Javan, Mehdi, Kalalipoor, Maryam, Seyyedan, Kaveh,

Silane and bonding of Resins to Ceramic Dr. K. Seyyedan* - Dr. M. Kalalipoor** - Dr. M. Javan***Assistant Professor of Fixed Prosthodontics Dept., Faculty of Dentistry, Shaheed Beheshti University of Medical Sciences. **Resident of Fixed Prosthodontics Dept., Faculty of Dentistry, Shaheed Beheshti University of Medical Sciences. Background and Aim: When bonding between two different dental mate...

ژورنال: مجله دندانپزشکی 2019

Background and Aims: The aim of the present study was to evaluate the effect of applying hydrophobic resin after use of different generation of the bonding systems on nanoleakage. Materials and Methods: 20 third molar teeth were selected. The teeth were randomly divided into 4 groups of 5, each was treated using the fourth, fifth, sixth, and seven generation of dentin bonding. Then, the crown ...

In the present study, the microstructure and mechanical properties of the dissimilar joint of Inconel 625 (IN-625) superalloy to austenitic stainless steel AISI316L (SS-316L) via AWS-BNi3 interface layer and transient liquid phase (TLP) bonding process were evaluated and necessary conditions for creating an efficient joint were determined. TLP bonding was performed in temperature and time range...

In the present study, the microstructure and mechanical properties of the dissimilar joint of Inconel 625 (IN-625) superalloy to austenitic stainless steel AISI316L (SS-316L) via AWS-BNi3 interface layer and transient liquid phase (TLP) bonding process were evaluated and necessary conditions for creating an efficient joint were determined. TLP bonding was performed in temperature and time range...

2009
Zvonimir Maksić Elfi Kraka Michael Filatov Dieter Cremer

Nine AuX molecules (X = H, O, S, Se, Te, F, Cl, Br, I), their isoelectronic HgX analogues, and the corresponding neutral HgX diatomics have been investigated using NESC (Normalized Elimination of the Small Component) and B3LYP theory to determine relativistic effects for bond dissociation energies (BDEs), bond lengths, dipole moments, and charge distributions. Relativistic effects are substanti...

2009

INTRODUCTION ADHESIVE DENTISTRY • Indications for Use of Adhesives • Advantages of Bonding Techniques • Mechanism of Adhesion • Factors Affecting Adhesion ENAMEL BONDING • Steps for Enamel Bonding • Mechanism of Etching DENTIN BONDING • Conditioning of Dentin • Priming of Dentin • Moist vs Dry Dentin DENTIN BONDING AGENT • Mechanism of Bonding • Evolution of Dentin Bonding Agents • Nanofilled B...

Journal: :journal of dentistry, tehran university of medical sciences 0
mahshid mohammadi basir shahed university mohammad bagher rezvani shahed university elham tabatabai ghomsheh zahra malek hosseini

objectives: this study aimed to determine the effect of surface treatments such as tooth reduction and extending the etching time on microtensile bond strength (µtbs) of composite resin to normal and fluorotic enamel after microabrasion. materials and methods: fifty non-carious anterior teeth were classified into two groups of normal and fluorotic (n=25) using thylstrup and fejerskov index (tfi...

Journal: :Microelectronics Reliability 2012
S. L. Lin W. C. Huang C. T. Ko Kuan-Neng Chen

Process optimization of BCB polymer to silicon oxide bonding was investigated. The suitable bonding temperature is about 300 C, while bond failure of BCB-to-oxide bonding is observed starting from 400 C. Bonding interface morphologies and bond strengths of BCB-to-oxide bonding were investigated as well. PECVD oxide to BCB bonding has better bonding quality than that of thermal oxide to BCB bond...

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