High energy ball mills are used to grind powder material down to a particle size below one micron. Up to now, the detailed physical mechanisms of the grinding process inside the mill have not been fully understood. Hence, the design of these mills as well as their process parameters is based on empirical results. The ball mill has been simulated by discrete event simulation (DES) using typical ...

The purpose of this study was to evaluate grinding efficiency in abutment teeth comprising both dentin and core composite resin in the axial plane. Grinding was performed over 5 runs at two loads (0.5 or 0.25 N) and two feed rates (1 or 2 mm/sec). The grinding surface was observed with a 3-D laser microscope. Tomographic images of the grinding surfaces captured perpendicular to the feed directi...

In this paper, iron ore sample from the Chadormalu was investigated to determine some comminution properties. Chadormalu deposit is one of the largest iron ore mine in Iran, which is located in Yazd province. The representative ore sample contained 57%Fe, 0.9%P and 0.17%S. The sample was crushed; afterward, it was ground in various grinding times according to the Bond Ball mill approach to spec...

New π-conjugated oligomers with high crystallinity were prepared from the simple solvothermal reaction of squaric acid and diaminopyrenes. The oligomers were bonded at the 1,3- and 1,6-positions of the pyrene units, oligo(sq-alt-1,3py) and oligo(sq-alt-1,6py), which greatly affected their planar configuration and resulting mechanochromic properties. Oligomers containing a charge transfer (CT) c...

This study investigates the grinding of sintered silicon nitride using a SiC wheel with a fine abrasive grit size and dense vitreous bond. The difference of hardness between the green SiC abrasive and sintered Si3N4 workpiece (25.5 vs. 13.7 GPa) is small. Large grinding forces, particularly the specific tangential grinding forces, are observed in SiC grinding of Si3N4. The measured specific gri...

Complete List of Authors: Chang, Yu-Chia; University of California, Santa Barbara, Electrical & Computer Engineering Dept. Wang, Chad; University of California, Santa Barbara, Electrical and Computer Engineering Johansson, Leif; University of California, Santa Barbara, Dept.of Electrical & Computer Engineering and Materials Dept. Coldren, Larry; University of California, Santa Barbara, Electric...

During the past decade submicron and nanoparticles have aroused a wide interest and gained new applications due to their high surface area and strength. Grinding with a wet stirred media mill is usually the last process step before the submicron or nanoparticles are added to an application, and the step where the final particle size distribution is achieved. Since stirred media milling is an en...