Abstract The background of this research is to optimize the use heat from solar energy as harvesting based on a thermoelectric generator (TEG). One factors that affect TEG output configuration and resulting temperature difference. external captured by side cooling system causes significant This study uses trainer module consisting eight TEGs double heatsink functions for capture sun. Experiment...

A new package for power semiconductors has been developed: Power semiconductor chips are soldered onto a DCB ceramic substrate together with a lead frame with up to ve pins. Subsequently chips and DCB are covered by molding compound. This packaging method combines the technologies of module and discrete assembly. Thus the resulting component provides a combination of the characteristics of both...

With the continued increase in power dissipation and power density of high-performance microprocessors, as well as requirements for high-density packaging and lower device junction temperatures, improvements of electronic cooling technologies have been becoming strategically important in the challenge of advanced thermal solutions for achieving higher cooling efficiencies while meeting reliabil...

The emergence of silicon carbide(SiC-) based power semiconductor switches with their superior features compared with silicon (Si) based switches has resulted in substantial improvements in the performance of power electronics converter systems. These systems with SiC power devices are more compact, lighter, and more efficient, so they are ideal for high-voltage power electronics applications, i...

Article history: Received 30 May 2012 Accepted 24 June 2012 Available online 12 August 2012 0026-2714/$ see front matter 2012 Elsevier Ltd. A http://dx.doi.org/10.1016/j.microrel.2012.06.087 ⇑ Tel.: +81 52 612 6111; fax: +81 52 612 5623. E-mail address: [email protected] A power semiconductor module using a bonding film with anisotropic thermal conduction has been studied. The bonding fil...

The use of Aluminum Gallium Nitride (AlGaN) as a power switching device material has been promising topic research in recent years. Along with Silicon Carbide (SiC) and (GaN), AlGaN is categorized Wideband Gap (WBG) intrinsic properties best suited for high applications. This paper simulates compares the thermal electrical performance (Si) MOSFETs, modeled COMSOL Multiphysics. Comparisons betwe...

In this paper, a Pareto multiobjective optimization is performed to design new luminaires, finding the optimal forward current, number of LEDs and proper heatsink by taking into account the cost, the energy consumption and the impact on the environment (life cycle analysis from cradle to grave). Three commercialized white LEDs have been studied and modelled in terms of optical, electrical, ther...

Polymer adhesives offer a viable method for mounting silicon dies for high temperature applications. Here a test vehicle for comparing the thermal conductivity of different die attach materials is presented. The setup can be used to determine the degree of degradation of polymers. It consists of a mock die that has an integrated thick film heater, which is mounted onto a substrate. In operation...