In this research, tribological characteristics of Ni-P electroless coating and double-layered Ni-P/Ni-B electroless coating were studied. For this purpose, Ni-P electroless coating with 25 μm thickness was initially applied to the surface of steel Ck45 samples; then, a double-layered Ni-P/Ni-B electroless coating, including inner layer of Ni-P with 15 μm thickness and outer layer of Ni-B with 1...

Electroless cobalt films have been obtained by deposition using a plating bath containing two reducing agents: dimethylamineborane (DMAB) and sodium hypophosphite. This formulation allows spontaneous activation on copper followed by auto catalytic electroless plating. CoWBP and CoBP films are proposed as diffusion barriers and encapsulation layers, for copper lines and via contacts for ULSI int...

Conductive nanotubes consisting of indium tin oxide (ITO) were fabricated by electroless deposition using ion track etched polycarbonate templates. To produce nanotubes (NTs) with thin walls and small surface roughness, the tubes were generated by a multi-step procedure under aqueous conditions. The approach reported below yields open end nanotubes with well defined outer diameter and wall thic...

Two commercially available silver inks were inkjet printed to fabricate the seed tracks (seed layers) of radio frequency (RF) circuit structures on a high frequency substrate material. One of them is a nanoparticle based ink, and the other, a non-particle based organic silver complex ink. Subsequent to printing, these seed layers were copper plated using an electroless copper plating process, t...

Pemakaian bahan baja karbon rendah ASTM A36 sebagai dasar bangunan konstruksi pipa dan tanki yang dimodifikasi menggunakan proses pelapisan Electroless Ni-P. Proses ini bertujuan untuk meningkatkan sifat-sifat harus dimiliki oleh plat dari ketahanan korosinya. Dengan variasi temperatur kekasaran permukaan serta penambahan perlakuan panas, karakteristik lapisan electroless Ni-P berupa nilai laju...

Vertically aligned silicon nanowires (SiNWs) were cost-effectively formed on a four-inch silicon wafer using a simple room temperature approach, i.e., metal-assisted electroless etching. Tapering the NWs by post-KOH dipping achieved separation of each NW from the bunched NW, resulting in a strong enhancement of broadband optical absorption. As electroless etching time increases, the optical cro...

Dome-shaped gold nanoparticles (with an average diameter of 10.5 nm) are grown on H-terminated Si(100) substrates by simple techniques involving electro- and electroless deposition from a 0.05 mM AuCl3 and 0.1 M NaClO4 solution. XPS depth profiling data (involving Au 4f core-level and valence band spectra) reveal for the first time the formation of gold silicide at the interface between the Au ...

We propose a novel method to fabricate three-dimensional magnetic microparts, which can be integrated in functional microfluidic networks and lab-on-a-chip devices, by the combination of two-photon microfabrication and selective electroless plating. In our experiments, magnetic microparts could be successfully fabricated by optimizing various experimental conditions of electroless plating. In a...