Surface nanocrystallization using a surface mechanical attrition treatment effectively activates the surface of magnesium alloys due to the increase in grain boundary diffusion channels. As a result, the temperature of subsequent surface alloying treatment of pure Mg and AZ91 alloy can be reduced from 430 degrees C to 380 degrees C. Thus, it is possible to combine the surface alloying process w...

Dendritic and porous Ag-Pd alloy nanostructures were successfully fabricated on the surface of silicon substrate using the co-reduction method and galvanic replacement reaction, respectively. The molar compositions of Ag and Pd in the alloy could be modulated by controlling the molar ratios of metal precursors and reaction time. The Ag-Pd alloy nanostructures were characterized by transmission ...

2014 SANS in metallic glasses is anisotropic and depends on the orientation of the ribbons. Pd-based melt-spun and Nibased electrochemically deposited glasses exhibit different anisotropies. Both glasses contain scattering centres of the order of 40 nm wide in the ribbon plane. In the melt-spun alloy, the scatterers are very thin along the thickness perpendicular to the substrate. In the deposi...

A Si-based waveguide photodetector with a response in the 1.3–1.55m wavelength range is demonstrated. The active absorption layer of the pin photodiode consists of a SiGeC alloy epitaxially grown on a Si substrate with a Ge content of 55% and a thickness of 800 Å. The external quantum efficiency for a 400m-long waveguide, measured by using a single-mode fiber coupled to the waveguide facet, is ...

It is considered as a challenge for RABiTS route to get cube textured Ni-W alloy substrates with high mechanical and magnetic properties for coated conductors. The works of our group in recent years are summarized about different Ni-W substrates with high W content and composite tapes made by RABiTS technique. The fabrication process and the mechanism of cube texture formation in above differen...

Adhesive bonding is a well-known technics to assembly dies or wafer on a host substrate through polymer or solder bumps. To combine electronic and photonic systems on a single chip, we propose hereby to use AuSn alloy as bonding medium combined to waferscale technology and post-bonding III-V processing alleviating so the need of alignment accuracy between wafers. For instance, high density LED’...

The physical-mechanical properties of Ti-Ni-Ta and Ti-Ni-Ta-Si-based surface alloys ~1 μm thickness synthesized on the NiTi substrates by additive thin-film electron beam method were investigated. effect these functional composite systems [Ti-Ni-Ta alloy/TiNi substrate] [Ti-Ni-Ta-Si was explored. It established that Ti-Ni-Ta-Si based alloy with an amorphous structure is characterized higher gra...

Ni-Fe alloy/ZnO nanorod composites were fabricated and the magnetoelectric effect was demonstrated. The ZnO and Ni-Fe alloy serve as the piezoelectric phase and the magnetostrictive phase in the nanocomposite, respectively. Since the nanorod structure possesses the inherent nature of a large surface-to-volume ratio, it greatly enhances the interplay between the piezoelectric and magnetostrictiv...

The causes of mechanical failure of five noncemented porous-coated components were studied. There were two cobalt-chromium alloy and three titanium alloy implants which fractured after 12 to 48 months. The implants included one acetabular component, and one femoral condylar, one patellar and two tibial components. Examination of the fractured surfaces revealed fatigue to be the mechanism of fai...

The magnetization switching of Co0 25Pd0 75 alloy film on Pb(Zr0 52Ti0 48)O3 substrate was studied by measuring the polar Kerr rotation hysteresis loops and their electric field dependencies. It was found that the direction of spontaneous magnetization in CoPd alloy film was easily controllable via the inverse piezoelectric effect of the lead zirconate titanate layer, judging from the change of...