نتایج جستجو برای: 45 wt cu

تعداد نتایج: 354681  

Journal: :Materials Science and Engineering: A 2018

Journal: :Science and Engineering of Composite Materials 2019

Journal: :Materials Sciences and Applications 2011

Journal: :Microelectronics Reliability 2011
Asit Kumar Gain Y. C. Chan Winco K. C. Yung

Nano-sized, nonreacting, noncoarsening ZrO2 particles reinforced Sn–3.0 wt%Ag–0.5 wt%Cu composite solders were prepared by mechanically dispersing ZrO2 nano-particles into Sn–Ag–Cu solder. The interfacial morphology of unreinforced Sn–Ag–Cu solder and solder joints containing ZrO2 nano-particles with Au/Ni metallized Cu pads on ball grid array (BGA) substrates and the distribution of reinforcin...

Journal: :Applied and environmental microbiology 2012
Laura Rio Ewelina Kusiak-Nejman John Kiwi Bertrand Bétrisey César Pulgarin Andrej Trampuz Alain Bizzini

Bacteria can survive on hospital textiles and surfaces, from which they can be disseminated, representing a source of health care-associated infections (HCAIs). Surfaces containing copper (Cu), which is known for its bactericidal properties, could be an efficient way to lower the burden of potential pathogens. The antimicrobial activity of Cu-sputtered polyester surfaces, obtained by direct-cur...

1999
W. F. MIAO

Effects of Cu content and preaging treatments on precipitation sequence and artificial aging response in aluminum alloy 6022 were investigated using transmission electron microscopy (TEM), differential scanning calorimetry (DSC), and hardness tests. It was found that Cu induces the formation of Q and its precursor metastable phases and has a beneficial effect on the kinetics of artificial aging...

2010
G. J. Liu K. Mimura M. Isshiki

The influence of alloying element S, Se or Te on the oxidation resistance of pure Cu was studied by oxidizing in 0.1 MPa pure oxygen atmosphere at 573-873 K in comparison with a 6N Cu (99.9999 wt.%). The addition of S, Se or Te is found to improve the oxidation resistance of Cu remarkably. This improvement is contributed from the accumulation of alloying element at the Cu2O/Cu interface and seg...

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