Mass mortality occurred among Penaeus vannamei shrimp cultured in Korea in 2004. In an earlier study, we reported white spot syndrome virus (WSSV) as a causative agent of mass mortality of P. monodon shrimp in Korea (Moon et al. 2003; Dis Aquat Org 53:11-13). However, in the present study, we detected Taura syndrome virus (TSV) from the moribund 2004 P. vannamei shrimp by reverse transcription ...

Aim. To evaluate the effectiveness of subconjunctivally injected viscoelastic material (VEM) for the self-sealing of leaking sclerotomy in transconjunctival sutureless vitrectomy (TSV). Methods. This was a prospective interventional series. Subconjunctival injection of VEM was performed in eyes showing leaking sclerotomy at the end of TSV in selected cases. This procedure was performed in 24 co...

Continual scaling of on-chip wiring structures has brought significant challenges for materials and processes beyond the 32 nm technology node in microelectronics. Recently threedimensional (3-D) integration with through-silicon-vias (TSVs) has emerged as an effective solution to meet the future interconnect requirement. Among others, thermo-mechanical reliability is a key concern for the devel...

This article presents several grand challenges in the area of physical design for through-silicon via (TSV) based 3D ICs. Most of these issues are centered around TSVs, which are a new element of the 3D IC layout. Fundamental understanding of the electrical, mechanical, and thermal properties of TSVs is essential in successful physical design of TSV-based 3D ICs. Further investigation of the im...

In this paper, we present a transient modeling of electromigration (EM) in TSV and TSV-to-wire interfaces in the power delivery network (PDN) of 3D ICs. In particular, we model atomic depletion and accumulation, effective resistance degradation, and full chip-scale PDN lifetime degradation due to EM. Our major focuses are on: (1) timedependent multi-physics EM modeling approach to model TSVs an...

Reliability risks for two different types of through-silicon-vias (TSVs) are discussed in this paper. The first is a partially-filled copper TSV, if which the copper layer covers the side walls and bottom. A polymer is used to fill the rest of the cavity. Stresses in risk sites are studied and ranked for this TSV structure by FEA modeling. Parametric studies for material properties (modulus and...

Trichodysplasia spinulosa-associated polyomavirus (TSV) is responsible for a rare skin cancer. Using metagenomic approaches, we determined the complete genome sequence of a TSV first detected in Brazil in spicules of an immunocompromised patient suspected to have trichodysplasia spinulosa.

Attackers can leverage security vulnerabilities in control systems to make physical processes behave unsafely. Currently, the safe behavior of a control system relies on a Trusted Computing Base (TCB) of commodity machines, firewalls, networks, and embedded systems. These large TCBs, often containing known vulnerabilities, expose many attack vectors which can impact process safety. In this pape...

Tityus serrulatus sting causes thousands of deaths annually worldwide. T. serrulatus-envenomed victims exhibit local or systemic reaction that culminates in pulmonary oedema, potentially leading to death. However, the molecular mechanisms underlying T. serrulatus venom (TsV) activity remain unknown. Here we show that TsV triggers NLRP3 inflammasome activation via K(+) efflux. Mechanistically, T...

Tobacco streak virus (TSV) has a wide host range that exceeds 80 species (Fulton, 1948). Most of the efforts carried out previously comparing TSV isolates was based on immunological relations between them. The isolates of the virus from Fragaria and Rubus have been considered to be very closely related if not identical while they are distinct from isolates of other hosts. While trying to charac...