Soft dielectric materials typically exhibit poor heat transfer properties due to the dynamics of phonon transport, which constrain thermal conductivity (k) to decrease monotonically with decreasing elastic modulus (E). This thermal-mechanical trade-off is limiting for wearable computing, soft robotics, and other emerging applications that require materials with both high thermal conductivity an...

The paper presents the methods used for realizing and characterizing the insulating lines of twin broadband microcalorimeters. Both thermal and electrical measurements have been applied, together with electro-thermal modelling, to insulating coaxial line assemblies of different type from dc to 40 GHz.

We present thermal conductivity measurements of micromachined 500 nm thick silicon-nitride Si–N beams suspended between two Si–N islands, in the temperature range from 77 to 325 K. The measured thermal conductivity, k, of Si–N at high temperatures is in good agreement with previously measured values for Si–N grown by low-pressure chemical vapor deposition, but behaves much differently as temper...

The thermogravimetric analysis (TGA) and the differential thermal analysis (DTA) were applied to investigations of aging processes in some electroinsulating polymeric materials (glass reinforced epoxy resin, NBR ( two sorts), styrenated unsatured polyester resin, hydrogenated NBR (T80), polychloroprene rubber , EPR) and to the measurement of aging reaction rates. It is shown that thermal analys...

The analytical models used by hot-wire type probes are no longer suitable for the characterization of insulating materials. This paper proposes a solution, which is based on numerical reduced order technique named AROMM (Amalgamated Reduced Order Modal Method) coupled to an inverse procedure. We demonstrate that single model provides precise results insulated materials characterized different t...