We provide an update on a gram-scale phonon-mediated KID-based device that was designed for sub-GeV dark matter search at the Northwestern Experimental Underground Site. Currently, is demonstrating 6 eV resolution energy absorbed by resonator. With some important assumptions, this translates to 20 baseline deposited in substrate. show TLS noise dominates estimate. After modifying design mitigat...

A methodology is proposed to characterize through silicon via (TSV) induced noise coupling in threedimensional (3D) integrated circuits. Different substrate biasing schemes (such as a single substrate contact versus regularly placed substrate contacts) and TSV fabrication methods (such as via-first and via-last) are considered. A compact π model is proposed to efficiently estimate the coupling ...

A modification to a recently developed chip/wafer integration technology has proven to be very effective in suppressing the substrate crosstalk for mixed signal systems. In this implementation, analog and digital chips are fabricated on separate dies, and then integrated on a single Si substrate using a Self-Aligned Wafer-Level Integration Technology. A truly grounded faraday-cage structure is ...

Microelectronics is heading towards larger and larger systems implementedon a single chip. In wireless communication equipment, e.g., cellular phones,handheld computers etc., both analog and digital circuits are required. Ifseveral integrated circuits (ICs) are used in a system, a large amount of thepower is consumed by the communication between the ICs. Furthermore, thecomm...

The use of wide bandgap materials for broadcast telecommunication and defense systems allow high power, high efficiency and high integration levels of active devices thanks to their microwave electrical performances. GaN based devices have also demonstrated great potential for high frequency linear low noise applications. However, low frequency noise (LFN) performances characteristics are still...

In a mixed analogue/digital system, the statechanges of digital circuits generate switching noise that is transferred through the substrate and the power-lines to sensitive analogue nodes. This work investigates how trade-offs with speed and power consumption can be used to decrease this substrate noise. Six different digital CMOS design techniques have been simulated and compared with respect ...

We have analyzed the dominant noise sources in the driving circuit of an uncooled infrared radiation focal plane array fabricated on a silicon-on-insulator (SOI) substrate by 0.35 μm CMOS technology and bulkmicromachining. We found no noise property of SOI-MOSFET inferior compared to those of NMOSs formed on SOI and bulk substrate, respectively. In addition, we reduced the total noise of the se...

An investigation of the effect of substrate loss on simultaneous switqhing noise (SSN) in on-chip power distribution networks is presented. In order to characterize the multi-layered power buses accurately for onship sdtching noise simulation, modeling of VddlGround rails over finite-resistivity substrates should include dielectric loss. The complete circuit model of power rails are then repres...