This study showed pronounced changes in the Raman scattering of silicon powder during high-energy ball milling. The powders were milled for 1–18 h in a steel ball mill in argon. The approximate pressure imposed on particles was 2 GPa. The spectra of the as-milled powders were compared with the initial silicon. It was found from the Raman peak position shifts that milling generated strains in th...

Metal matrix composites have been widely used in industries, especially aerospace industries, due to their excellent engineering properties. However, it is difficult to machine them because of the hardness and abrasive nature of reinforcement elements like silicon carbide particles (SiCp).In the present study, an attempt has been made to investigate the influence of spindle speed (N), feed rate...

In the organic field effect transistors (OFETs) generation, the silicon gate oxide is 1-2 nm thick. A shrinking of this thickness down to less than 1 nm for the next generation will led to a couple of orders of magnitude increase in tunnelling as well as leakage currents. NiO-SiO2 can be used in a variety of devices, such as in circuit boards and detectors, including sensors, due to its porous ...

The removal of dust particles from semiconductor surfaces requires new cleaning strategies such as Steam Laser Cleaning (SLC). It is based on laser-induced explosive evaporation of a liquid layer applied on the surface. We have investigated the laser-induced nucleation and growth of gas bubbles at silicon/water, silicon/isopropanol and silver-film/water interfaces by light scattering and surfac...

We calculate the second-order streaming force in a fluid in the vicinity of the solid/fluid interface for two systems of importance in the technology of megasonic cleaning of silicon wafers. The first system consists of a single planar interface between a solid elastic medium representing silicon and a viscous fluid, namely water. The second system accounts for the finite thickness of silicon w...

Powder formation in silane plasmas has been considered as a technology drawback because it might lead to the formation of macroscopic defects in the deposited layers. Here we summarize our recent efforts in controlling the formation of powder precursors, in particular, nanocrystalline silicon particles, aiming at their incorporation in the films. Indeed, the incorporation of clusters and crysta...

We have studied the removal of submicrometer particles from silicon wafers by the steam laser cleaning (SLC) and dry laser cleaning (DLC) processes. These processes are currently being investigated as new promising cleaning technologies for complementing traditional methods in industrial applications. For SLC a thin liquid layer (e.g. a water-alcohol mixture) is condensed onto the substrate, an...

We report a comprehensive study of laser-initiated, liquid-assisted colloidal (LILAC) lithography, and illustrate its utility in patterning silicon substrates. The method combines single shot laser irradiation (frequency doubled Ti-sapphire laser, 50fs pulse duration, 400nm wavelength) and medium-tuned optical near-field effects around arrays of silica colloidal particles to achieve 3-D surface...

Magnetic manipulation, fluorescent tracking, and localized delivery of a drug payload to cancer cells in vitro is demonstrated, using nanostructured porous silicon microparticles as a carrier. The multifunctional microparticles are prepared by electrochemical porosification of a silicon wafer in a hydrofluoric acid-containing electrolyte, followed by removal and fracture of the porous layer int...

metal matrix composites have been widely used in industries, especially aerospace industries, due to their excellent engineering properties. however, it is difficult to machine them because of the hardness and abrasive nature of reinforcement elements like silicon carbide particles (sicp).in the present study, an attempt has been made to investigate the influence of spindle speed (n), feed rate...