Abstract This paper presents the design and implementation of four control strategies applied to a real underactuated manipulator robot with 3-DOF (Degrees Freedom). Additionally, an original methodology for controlled oscillatory compensations is designed implemented mitigate effect passive joint on overall performance this robot. The objective create oscillations that allow faulty link its (p...

This paper proposed a kinematic model and its calibration scheme to further improve an industrial robots absolute positioning accuracy over the entire workspace. To demonstrate effectiveness in simplified kinematics, this only targets SCARA (Selective Compliance Assembly Robot Arm)-type robot. The includes not link length errors rotary axis angular offsets, widely known as Denavit-Hartenberg (D...

It has been proposed that cognitive reserve is supported by two neural mechanisms: neural compensation and neural reserve. The purpose of this study was to test how these neural mechanisms are solicited in aging in the context of visual selective attention processing and whether they are inter- or intra-hemispheric. Younger and older participants were scanned using fMRI during a visual letter-m...

Chromosomal or segmental aneuploidy-the gain or loss of whole or partial chromosomes-is typically deleterious for organisms, a hallmark of cancers, and only occasionally adaptive. To understand the cellular and organismal consequences of aneuploidy, it is important to determine how altered gene doses impact gene expression. Previous studies show that, for some Drosophila cell lines but not othe...

The separation of complex inner and outer contours glass articles with curved surfaces using ultrashort pulsed lasers is reported. Single-pass, full-thickness modifications along the entire substrate are achieved a processing optics that allows for beam shaping non-diffracting beams and, additionally, aberration compensation phase distortions occurring at interface. finally separated by thermal...

A broad-band power divider is presented in CMOS technology. The devices are realized by postprocessing chips that are fabricated in a standard 1.2m CMOS process. Developed postprocessing includes wire bonding for ground equalization, deposition of a stress-compensation layer, and selective etching of the silicon substrate. By employing coupled coplanar transmission lines, the area of dividers i...