We present an integrated chemical sensor array fabricated using a CMOS process followed by post-processing. The sensor presented in this paper incorporates 324 individually addressable sensing nodes. Post processing involves an electroless Nickel and Gold plating step to fabricate sensing contacts, and the deposition of a carbon black based polymer sensor material. The operation of the integrat...

We studied the effects of catalyst introduction methods using poly(amidoamine) (PAMAM) dendrimers on the nickel patterning of polyelectrolyte multilayer (PEM)-coated substrates. Three different approaches to palladium catalyst introduction using microcontact printing as the patterning technique were utilized and compared. The catalyst introduction methods are (1) direct catalyst stamping, (2) d...

A driving force to achieve increased speed and performance along with higher I/O count is the Flip Chip (FC) Technology which has therefore an high level of importance for a variety of applications. A breakthrough, however, will be the use of flip chip due to cost reduction. For this aim it is essential to use low cost bumping techniques. This paper shows a low cost wafer level bumping process ...