The application of Cu-filled through-silicon via (TSV) in 3-D integrated circuit packaging faces several fabrication and reliability issues. In this study, we introduced a Cu-Ni alloy for TSV filling with a high filling speed and a reduced TSV protrusion. In particular, the characteristics of Cu-Ni via protrusions at various annealing temperatures (3200­450°C) were investigated with experimenta...

Article history: Received 2.11.2012 Received in revised form 10.12.2012 Accepted 10.12.2012 Copper alloy has a lot of excellent properties, so it becomes an important alloy for lead frame materials for the integrated circuit. The minimum bending radius of three different copper alloys (Cu-Fe-P, Cu-Ni-Si, Cu-Cr-Sn-Zn) for lead frame materials was analyzed by using finite element. Tensile tests f...

In this report, a facile and effective one-pot oxidation-assisted dealloying protocol has been developed to massively synthesize monolithic core-shell architectured nanoporous copper@cuprous oxide nanonetworks (C-S NPC@Cu2O NNs) by chemical dealloying of melt-spun Al 37 at.% Cu alloy in an oxygen-rich alkaline solution at room temperature, which possesses superior photocatalytic activity toward...

Two experiments were conducted to determine the effects of Cu deficiency with or without high dietary Mo or Fe on the specific immunity of calves. In Exp. 1, calves from 38 bred heifers, fed corn silage-based experimental diets from the last third of gestation until the calves were weaned, were used. Dietary treatments were control (no supplemental Fe, Mo, or Cu), 600 mg of supplemental Fe/kg o...

High-strength low-carbon ferritic steels attaining a maximum yield strength of 1600 MPa by combined Cu and NiAl precipitationstrengthening were developed. The yield strength of the alloys increases monotonically with the total concentration of the principal alloying elements i.e. Mn, Cu, Ni and Al. At 12.40 at.%, a 1600 MPa yield strength is achieved after solution treatment at 950 C followed b...

Sb based alloy nanostructures have attracted much attention due to their many promising applications, e.g. as battery electrodes, thermoelectric materials and magnetic semiconductors. In many cases, these applications require controlled growth of Sb based alloys with desired sizes and shapes to achieve enhanced performance. Here, we report a flexible catalyst-free chemical vapor deposition (CVD...

The roles of the alloying elements Mo, Cr, and W in resisting crevice corrosion of UNS N06022, UNS N06625, and UNS N10362 have been studied under galvanostatic conditions in 5 mol/L NaCl at 150°C. Corrosion damage patterns were investigated using surface analytical techniques such as scanning electron microscopy and optical imaging, and the corrosion products characterized by energy dispersive ...

The effect of Cu on the localized corrosion of Ni-Cr-Mo alloys has been investigated in hot saline solutions by comparing the behavior of N06059 and N06200 alloys, using electrochemical and surface analytical techniques. No measurable effect of copper on anodic film growth kinetics and passive film properties was detected and the breakdown and repassivation potentials of the alloys were very si...

Seasonal changes in herbage elements (Cu, Mo, S, Fe), pasture growth, and soil moisture were measured and their relationships with liver Cu concentration in weaner heifers (n=10–12) and breeding cows (n=10–12) were determined on 7 commercial farms in the Wairoa region. Liver biopsy samples were collected at 2 to 4 monthly intervals and herbage and soil moisture monthly from spring 1996 to sprin...