نتایج جستجو برای: microelectronic processing

تعداد نتایج: 500511  

Journal: :Journal of neural engineering 2007
L E Hallum G Dagnelie G J Suaning N H Lovell

Microelectronic vision prosthesis proposes to render luminous spots (so-called phosphenes) in the visual field of the otherwise blind subject by way of an implanted array of stimulating electrodes, and in doing so restore some spatial vision. There are now many research teams worldwide working towards a therapeutic device, analogous to the cochlear implant, for the profoundly blind. Despite the...

Journal: :Applied Physics Letters 2022

Laser-based amorphization on the back surface of a 525- μm thick crystalline silicon sample is studied. To deposit sufficient energy for local change from to an amorphous state, laser irradiation at 2- wavelength with 25-ps pulse duration combined Bessel beam shaping. Deterministic single-site modifications and homogeneous continuous lines are demonstrated. Optical electron microscopy together ...

2017
Donguk Kim Chan Bae Jeong Jung Dae Kim Kye-Sung Lee Hwan Hur Ki-Hwan Nam Geon-Hee Kim Ki Soo Chang

In this paper, we report on a confocal thermoreflectance imaging system that can examine the thermal characteristics of microelectronic devices by penetrating the backside of a device through the substrate. In this system, the local reflectivity variations due to heat generation in the device are measured point by point by a laser scanning confocal microscope capable of eliminating out-of-focus...

2010
Vincent McGahay

Porous insulators are utilized in the wiring structure of microelectronic devices as a means of reducing, through low dielectric permittivity, power consumption and signal delay in integrated circuits. They are typically based on low density modifications of amorphous SiO2 known as SiCOH or carbon-doped oxides, in which free volume is created through the removal of labile organic phases. Porous...

Journal: :Microelectronics Reliability 2013
K. N. Tu Hsiang-Yao Hsiao Chih Chen

As microelectronic industry develops 3D IC on the basis of through-Si-vias (TSV) technology, the processing and reliability of microbumps, which are used to interconnect the stacking chips, is being actively investigated. Due to the reduction in size of microbumps, the diameter is about one order of magnitude smaller than that of flip chip solder joints, and the volume is 1000 times smaller. It...

پایان نامه :وزارت علوم، تحقیقات و فناوری - دانشگاه فردوسی مشهد - دانشکده مهندسی 1387

چکیده ندارد.

N. Nithya, R. Mahalakshmi, S. Sagadevan,

The study of amino acid based nonlinear optical (NLO) materials with optimum physical properties is an important area due to their practical applications such as optical communication, optical computing, optical information processing, optical disk data storage, laser fusion reactions, laser remote sensing, colour display, medical diagnostics, etc. Also, microelectronic industries require cryst...

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