The knowledge of the thermodynamic process during the cooling of reproductive biological systems is important to assess and optimize the cryopreservation procedures. The time-temperature curve of a sample immersed in liquid nitrogen enables the calculation of cooling rates and helps to determine whether it is vitrified or undergoes phase change transition. When dealing with cryogenic liquids, t...

This paper contains a few comments on the physical analysis of the factors controlling the rate of cooling, and the relation of the rate of cooling to ice crystal formation which has been carried out in connection with the electron microscopic work described by Dr. C-ersh at this conference. Of the many factors which influence the rate of cooling, by far the most important is the size of the sa...

Algorithmic cooling is a method that employs thermalization to increase qubit purification level, namely it reduces the qubit-system’s entropy. We utilized gradient ascent pulse engineering (GRAPE), an optimal control algorithm, to implement algorithmic cooling in liquid state nuclear magnetic resonance. Various cooling algorithms were applied onto the three qubits of C2trichloroethylene, cooli...

A commercially available, complete microprocessor controlled, fully automated 10 Volt Josephson voltage standard system with a liquid helium free cooling was developed in cooperation between the Institute of Photonic Technology and the Supracon AG. The system operates with an array of altogether 19,700 SIS Josephson tunnel junctions installed in a pulse tube cooler. The integration of the volta...

In this paper, we describe an experimental study of the phenomenon of spray cooling in the case of liquid helium, either normal or superfluid, and its relationship to the heat transfer between an atomized diphasic flow contained in a long pipe, and the pipe walls. This situation is discussed in the context of the cooling of the superconducting magnets of the Large Hadron Collider (LHC). Experim...

With the rapid improvement of computer performance, tremendous heat generation in the chip becomes a major serious concern for thermal management. Meanwhile, CPU chips are becoming smaller and smaller with almost no room for the heat to escape. The total power-dissipation levels now reside on the order of 100 W with a peak power density of 400–500 W/cm2, and are still steadily climbing. As a re...