Increasing environmental concerns and pending government regulations have pressured microelectronic manufacturers to find suitable alternatives to Pb-bearing solders traditionally used in electronics packaging. Over recent years, Sn-rich solders have received significant attention as suitable replacements for Pbbearing solders. Understanding the behavior of intermetallics in Sn-rich solders is ...

intermetallic phase formation and oxidation reaction during combustion synthesis (cs) of ni-ti equiatomic mixture are affected by mechanical activation (ma) and pre-heating conditions. important parameters are ignition time, reaction duration, temperature rise, microstructural change, titanium oxidation and intermetallic phase formation. superelasticity and shape memory effects are influenced b...

This work presents a detailed, combined experimental and theoretical study on the structural stability of s-p bonded compounds with the BaAl4 structure type (space group I4/mmm, Z = 2) as part of a broad program to investigate the complex questions of structure formation and atomic arrangements in polar intermetallics. From ab initio calculations employing pseudopotentials and a plane wave basi...

The structure, elastic properties and electronic structure of Ti-Al intermetallics including Ti3Al (space group P63/mmc), TiAl I4/mmm) TiAl3 P4/mmm) are systematically studied by first-principles calculations. results show that can exist stably whether Cr replaces Ti or Al. ductility the alloy cannot be improved when is replaced in Cr-doped TiAl3. However, it Al, has better ductility. In Ti3Al,...

As a partner for the DOE Metal Hydride Center of Excellence (MHCoE), GE Global Research in Niskayuna, NY developed a robust approach for metal hydride discovery as schematically shown in Figure 1. The approach is used on a daily basis at GE and it has streamlined the metal hydride discovery process. Our research allows us to investigate large numbers of compositions simultaneously, quickly scre...