The failure modes of flip chip solder joints under high electrical current density are studied experimentally. Three different failure modes are reported. Only one of the failure modes is caused by the combined effect of electromigration and thermomigration, where void nucleation and growth contribute to the ultimate failure of the module. The Ni under bump metallization–solder joint interface ...

An ion beam propagating through a magnetized plasma cylinder containing electrons, light positive potassium ions K+ , and heavy positive cesium ions Cs+ drives electrostatic ion cyclotron EIC waves to instability via Cerenkov interaction. Two EIC wave modes are present, the K+ and Cs+ modes. The unstable wave frequencies and the growth rate of both the light positive ion and heavy positive ion ...

Synthetic regrowth of ZnO nanowires [NWs] under a similar chemical vapor transport and condensation [CVTC] process can produce abundant ZnO nanostructures which are not possible by a single CVTC step. In this work, we report three different regrowth modes of ZnO NWs: axial growth, radial growth, and both directions. The different growth modes seem to be determined by the properties of initial Z...

Differential growth of thin elastic bodies furnishes a surprisingly simple explanation of the complex and intriguing shapes of many biological systems, such as plant leaves and organs. Similarly, inelastic strains induced by thermal effects or active materials in layered plates are extensively used to control the curvature of thin engineering structures. Such behaviour inspires us to distinguis...